Three-Level Inverter Power Unit Layout for Compact Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inverters with a three-level topology are not suitable for small-sized low-power power unit package structures, leading to higher overall costs due to the need for a larger number of parallel-connected low-power power units.
Innovation Solution
A power unit comprising three package modules with complementary switch transistors, arranged in a specific layout to facilitate a small-sized packaging structure like a 62 mm series IGBT module, and a power module with multiple power units connected in parallel to reduce costs and improve efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a three-level topology inverter uses small-sized low-power power units, then the packaging cost is reduced, but the overall inverter cost increases due to requiring a larger number of parallel-connected power units
Solution Approach 1:
The power unit is segmented into three distinct package modules (first, second, and third package modules), each containing two complementary switch transistors. This segmentation enables the use of compact individual packages while maintaining the required power capacity through their combined operation in a three-level topology configuration.
Solution Approach 2:
Multiple power units are connected in parallel to form a power module, merging their capabilities to achieve the required overall power output. This merging approach allows each individual power unit to be small-sized while the collective assembly meets the power requirements, resolving the contradiction between unit size and quantity.
2Device complexity
If control terminals are arranged on the same side of the power unit, then the driver board layout is simplified, but the packaging structure cannot accommodate small-sized modules
Solution Approach 1:
Different control terminals are positioned on different sides of the power unit based on their specific requirements. The first and second package modules have control terminals on a first side, while the third package module has its control terminal on a second side. This localized differentiation enables compact packaging while maintaining manageable driver board connections.
Solution Approach 2:
The control terminals are distributed across different spatial dimensions (different sides of the power unit) rather than being concentrated on a single side. This dimensional distribution allows the power unit to achieve a compact footprint while still providing accessible control terminals for driver board connections.
Data Source
AI summary
An inverter, a power unit and a power module applied to the inverter are provided. The power unit includes a first package module, a second package module, and a third package module, each including two switch transistors that are complementary to each other. Since the first package module and the second package module are arranged in one half of the inner space of the power unit, and the third package module is arranged in the other half of the inner space of the power unit, the control terminal of each of the three package modules is arranged on a side of the half for arranging the package module that is away from the other half. Thus, the power unit can adopt a small-sized packaging structure without changing a layout of driver boards, thereby reducing the cost of the power unit and the inverter.