Inverter Stack Heat Sink Partitioning for Thermal Management
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Solution Overview
Problem
Inverter stacks face issues with high temperature-induced component damage and performance degradation due to inadequate heat dissipation, leading to increased cooling apparatus capacity and device size, as well as elevated production costs.
Innovation Solution
The design includes an enclosure with an inlet port at the lower end and an outlet port at the upper end, featuring a heat sink with heat-dissipating fins that partitions the internal space to create an air passage for efficient heat dissipation, along with a cooling fan positioned at the outlet port to expedite the discharge of heat generated by high-heat components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high heat dissipation components are disposed far apart from the outlet port, then the components are protected from direct heat, but the heat dissipation path is lengthened and internal temperature increases
Solution Approach 1:
The internal space is segmented into a heat dissipation chamber and a component accommodation chamber by the heat sink body. This segmentation allows high heat dissipation components to be positioned near the outlet port for efficient heat removal, while other components are placed in the cooler accommodation chamber, thus protecting them from direct heat exposure while maintaining short heat dissipation paths.
2Temperature
If the capacity of the cooling apparatus is increased, then the cooling performance is improved, but the device size and production cost increase
Solution Approach 1:
The heat sink structure serves dual functions: it acts as both a heat dissipation device and a space partitioning element. By integrating the partitioning function into the heat sink body, the patent eliminates the need for separate partitioning structures, thereby reducing overall device size while maintaining effective heat dissipation performance.
3Temperature
If the capacity of the cooling apparatus is increased, then the cooling performance is improved, but the production cost increases
Solution Approach 1:
The heat sink body performs multiple functions simultaneously: heat dissipation, space partitioning, and structural support. This multi-functionality reduces the total number of components required, simplifying the manufacturing process and reducing production costs while achieving effective cooling performance.
4Volume of stationary object
If high heat dissipation components are disposed adjacent to each other, then the device size is reduced, but heat transfer to surrounding components increases causing performance degradation
Solution Approach 1:
The internal space is divided into distinct chambers by the heat sink body. High heat dissipation components are placed in the heat dissipation chamber near the outlet, while other components are positioned in the component accommodation chamber. This spatial segmentation prevents excessive heat transfer to sensitive components while maintaining a compact overall device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses internal temperature increases, reduces the cooling apparatus capacity, and decreases device size and production costs by shortening the heat dissipation path and optimizing the placement of high and low heat components.
Implementation Method 1
a heat sink having a switching element, disposed within an upper region of the internal space
Implementation Method 2
air drawn in from the inlet port flows to the outlet port
Implementation Method 3
a cooling fan configured to draw in air from the inlet port and discharge the air from the outlet port
Data Source
AI summary
An inverter stack includes an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space, a heat sink having a switching element, disposed within an upper region of the internal space, and a plurality of DC-link capacitors disposed within the internal space and below the heat sink. Through this, heat generated in high heat dissipation components is immediately moved upward by convection, thereby suppressing the damage of components due to high temperature.