Inverter Power Module with Distributed Substrate Cooling

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Solution Overview

Problem

In power electronics, traditional heat sinks used for cooling increase the size, weight, and cost of modules, and alternative cooling methods can cause deflection or cracking of substrates, posing challenges in packaging and reliability, especially in space-constrained applications like automotive systems.

Innovation Solution

The use of plastic support frames that house and seal the power electronic substrate, providing direct cooling and structural rigidity through cross supports and integral sealing elements, eliminating the need for heat sinks and preventing substrate deflection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat sinks are used for cooling power electronic substrates, then heat dissipation is improved, but weight and volume of the module increase

Engineering Contradiction:

Improveheat dissipationVSAvoidmodule weight

Core Design Contradiction:

TemperatureVSWeight of stationary object

Solution Approach 1:

The patent extracts and eliminates the heat sink component from the power module, replacing it with a cooling plate that provides direct substrate cooling. This removal of the traditional heat sink structure reduces module weight while maintaining effective heat dissipation through a different cooling mechanism.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical heat sink structure with a fluid-based direct substrate cooling system using cooling plates and coolant flow channels. This substitution transitions from solid-state thermal conduction through heat sinks to convective cooling through fluid circulation, achieving better heat dissipation with reduced weight.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If heat sinks are used for cooling power electronic substrates, then heat dissipation is improved, but volume of the module increases

Engineering Contradiction:

Improveheat dissipationVSAvoidmodule volume

Core Design Contradiction:

TemperatureVSVolume of stationary object

Solution Approach 1:

The patent removes the bulky heat sink structure and replaces it with a compact cooling plate system that integrates directly with the substrate. This extraction of the traditional heat sink component significantly reduces the overall module volume while maintaining effective cooling through direct contact and fluid circulation.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The cooling plate is designed to nest directly against the power electronic substrate, with coolant flow channels integrated within the plate structure itself. This nested configuration eliminates the need for separate heat sink components and mounting space, reducing overall module volume while maintaining effective thermal coupling.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Temperature

If alternative cooling methods are used to cool power electronic substrates, then heat dissipation is achieved, but substrate deflection and cracking occur

Engineering Contradiction:

Improvecooling effectivenessVSAvoidsubstrate integrity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent incorporates a compliant sealing element between the cooling plate and substrate that acts as a cushioning layer. This element compensates for thermal expansion and contraction differences between components, preventing stress concentration and substrate cracking while maintaining effective thermal coupling for heat dissipation.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent changes the mechanical compliance parameter of the interface between cooling plate and substrate by introducing a flexible sealing element. This parameter change allows the system to accommodate thermal stresses and dimensional changes during operation, preventing substrate deflection and cracking while maintaining cooling effectiveness.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces the weight and cost of power modules while maintaining effective cooling and structural integrity, preventing substrate deflection and enhancing reliability in power electronics applications.

Implementation Method 1

a cooling plate adapted to be in direct contact with the power electronic substrate and adapted to cool the power electronic substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a seal is formed between the first plastic frame and the power electronic substrate when the first plastic frame and the second plastic frame are joined together

Methodology Applied

Scientific EffectSealing:

Data Source

PatentUS8248809B2Inverter power module with distributed support for direct substrate cooling

Publication Date: 2012.08.21 GM GLOBAL TECHNOLOGY OPERATIONS LLC

AI summary

Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.