Transistor Package Assembly for Inverter Heat Dissipation
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Solution Overview
Problem
Inverters used in electric vehicles face inefficiencies in heat dissipation and cost-effectiveness, particularly during the conversion of DC to AC, which affects their operational efficiency and scalability in industrial production.
Innovation Solution
The solution involves improved packaging and structural designs for inverters, including the use of sintered silver layers for heat dissipation, u-bend connectors for reduced thermal stress, and specifically designed busbars to reduce impedance, along with double-sided press blocks for uniform pressure application, enhancing thermal performance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging and structural designs are used for inverters, then manufacturing cost is reduced, but thermal performance and heat dissipation efficiency deteriorate
Solution Approach 1:
The patent employs sintered silver layers as thermal interface material between the transistor package and heat sink, creating a composite thermal path that combines the high thermal conductivity of sintered silver with the structural properties of the transistor package and heat sink, thereby achieving superior heat dissipation performance
Solution Approach 2:
The inverter is divided into modular transistor packages that can be independently assembled onto the heat sink using sintered silver layers, allowing for standardized manufacturing processes while optimizing thermal performance through controlled thermal paths
2Reliability
If conventional connectors are used without u-bend design, then structural simplicity is maintained, but thermal stress and fatigue increase
Solution Approach 1:
The connector geometry is modified by introducing a u-bend configuration that changes the mechanical parameters of the connection, allowing it to accommodate thermal expansion and contraction cycles, thereby reducing thermal stress and improving fatigue resistance
Solution Approach 2:
The u-bend connector design inherently provides mechanical compliance that cushions against thermal stress before it can cause damage, acting as a built-in protective mechanism against thermal fatigue
3Loss of energy
If conventional busbars are used without specific design, then manufacturing complexity is reduced, but impedance increases
Solution Approach 1:
The busbar is designed with locally optimized geometry, including specific cross-sectional shapes and connection configurations, that reduce impedance in critical current paths while maintaining standard manufacturing processes for the overall component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These enhancements lead to improved thermal performance, reduced fatigue, and increased efficiency in heat dissipation, resulting in more reliable and cost-effective inverter production for industrial-scale use.
Implementation Method 1
sintered silver layers for heat dissipation
Implementation Method 2
sintered silver layers
Data Source
AI summary
A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.