Inverter Two-Phase Cooling Layout for High-Power Heat Dissipation
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Solution Overview
Problem
The increasing power of inverters generates high heat that conventional air-cooling methods cannot effectively dissipate, affecting the performance and reliability of power semiconductor devices and the overall inverter system.
Innovation Solution
A heat dissipation system using a radiator with an evaporator and condenser connected by a two-phase pipeline, combined with fans and air channels, to efficiently transfer and condense refrigerant for heat dissipation, reducing the need for additional driving mechanisms and minimizing floor space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air-cooling heat dissipation is used for power semiconductor devices, then the structure is simple and easy to implement, but the heat dissipation capability is insufficient when power increases
Solution Approach 1:
The patent employs phase transition of refrigerant (liquid to gas in evaporator, gas to liquid in condenser) to achieve efficient heat transfer. The refrigerant absorbs heat from power semiconductor devices through evaporation and releases heat to the environment through condensation, providing superior heat dissipation capability compared to conventional air-cooling methods while maintaining system reliability.
Solution Approach 2:
The patent utilizes a closed-loop refrigerant circulation system with evaporator, condenser, and connecting pipelines to transport refrigerant throughout the heat dissipation apparatus. This hydraulic system enables continuous heat removal from high-power components, resolving the contradiction between structural simplicity and heat dissipation effectiveness.
2Reliability
If multiple heat dissipation components are added to improve cooling, then heat dissipation performance improves, but device complexity increases
Solution Approach 1:
The patent integrates the heat dissipation apparatus with the inverter cabinet structure, where the evaporator is disposed within the cabinet and thermally coupled to power semiconductor devices. The condenser may be positioned on the cabinet exterior or interior, sharing space with other components. This merging approach provides enhanced heat dissipation while minimizing additional structural complexity.
Solution Approach 2:
The refrigerant circulation system serves multiple functions: cooling power semiconductor devices through the evaporator, dissipating heat to the environment through the condenser, and potentially cooling other cabinet components. This multi-functionality improves heat dissipation performance without proportionally increasing system complexity.
3Device complexity
If the condenser is positioned above the evaporator, then refrigerant circulation is simplified by using gravity, but the floor area of the inverter increases
Solution Approach 1:
The patent allows flexible spatial arrangement of the condenser and evaporator, including vertical stacking (condenser above evaporator) to utilize gravity for refrigerant return, horizontal positioning to save floor space, or diagonal configurations. This dimensional flexibility enables optimization between structural simplicity and compact footprint based on specific application requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation capability, increases power density, and improves the reliability and performance of inverter components by effectively managing heat generation.
Implementation Method 1
heat generated by the power semiconductor device may be conducted to the evaporator, to evaporate a liquid refrigerant in the evaporator into a gaseous state
Implementation Method 2
this gaseous refrigerant may enter the condenser through a gas pipeline in the two-phase pipeline to be re-cooled and condensed into a liquid refrigerant
Implementation Method 3
the power semiconductor device may be in thermally conductive contact with the evaporator. In this case, heat generated by the power semiconductor device may be conducted to the evaporator
Implementation Method 4
then the liquid refrigerant flows back to the evaporator through a liquid pipeline in the two-phase pipeline under the action of gravity
Data Source
AI summary
An inverter includes a housing and a heat dissipation apparatus. The housing may include a first cavity and a second cavity, and a power semiconductor device is disposed in the first cavity. The second cavity has a first air inlet and a first air outlet, and a magnetic component is disposed in the second cavity. The heat dissipation apparatus includes a radiator and a first fan. The radiator includes an evaporator and a condenser that are connected to each other. The evaporator is disposed in the second cavity. The power semiconductor device is in thermally conductive contact with the evaporator, to dissipate heat for the power semiconductor device. The first fan is disposed in the second cavity, an air inlet side of the first fan faces the first air inlet, and an air outlet side of the first fan faces the first air outlet.