Inverting Device Heat-Resistant Clamping Layer for LCD Panel Manufacturing
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Solution Overview
Problem
Existing inverting devices for liquid crystal display panel manufacturing produce wear debris from clamping members that melt and adhere to the substrates during heat-curing, leading to defective products due to the low melting points of materials like polyolefin used in the clamping members.
Innovation Solution
The inverting device features a substrate contact and support portion with a covering layer made of materials with a deformation temperature higher than the heat-curing temperature, preventing wear debris from melting and adhering to the substrates, and includes a slipping-down prevention portion to maintain substrate position during inversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If clamping members with polyolefin covering layers are used to clamp substrates, then the clamping members are inexpensive and easy to manufacture, but wear debris is generated that melts and adheres to substrates during heat-curing
Solution Approach 1:
The patent changes the material parameter of the covering layer from polyolefin (melting point 100-120°C) to a material with a melting point of 150°C or higher. This parameter change prevents the wear debris from melting during the heat-curing process (130°C), thereby eliminating the adhesion problem while maintaining the ease of manufacture advantage.
Solution Approach 2:
The patent employs composite material structure for the clamping members, using a metal core portion combined with a covering layer of material having high melting point (150°C or higher). This composite structure provides both the mechanical strength needed for clamping and the thermal stability to prevent wear debris melting during heat-curing.
2Strength
If clamping members are pressed to clamp substrates during inversion, then the substrates are securely held, but wear debris is produced that melts and adheres to the substrate surface
Solution Approach 1:
The patent changes the melting point parameter of the covering layer material from below 130°C to 150°C or higher. This ensures that the wear debris generated during clamping does not melt during the subsequent heat-curing process, preventing harmful adhesion to the substrate surface while maintaining effective clamping force.
3Ease of manufacture
If a covering layer with low melting point is used on clamping members, then the clamping members are cost-effective, but the wear debris melts during heat-curing causing defective products
Solution Approach 1:
The patent changes the melting point parameter of the covering layer material to 150°C or higher, which is above the heat-curing temperature (130°C). This parameter change prevents wear debris from melting during heat-curing, ensuring high product quality while the manufacturing process remains simple and cost-effective.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the occurrence of defective products by preventing wear debris from melting and adhering to the substrates, ensuring a stable and reliable manufacturing process for liquid crystal display panels.
Implementation Method 1
the covering portion of the substrate contact portion and the covering portion of the substrate support portion are formed of a material, a deformation temperature of the material being higher than a heat-curing temperature of a sealing member for a bonded substrate to be clamped between the covering portion of the substrate contact portion and the covering portion of the substrate support portion, a deformation being due to softening, melting or thermal decomposition of the material
Data Source
AI summary
Provided are an inverting device capable of suppressing a defect caused by wear debris generated by contacting and sliding of clamping members on a substrate with a sealing member, the wear debris being melted when heating the substrate and then adhered thereto after cooling thereof, and a manufacturing method of a liquid crystal display panel using the inverting device. The inverting device includes a main body, an inverting portion, a substrate contact portion, and a substrate support portion. The substrate contact portion and the substrate support portion clamp the substrate, and the inverting portion inverts the substrate. The substrate contact portion and the substrate support portion each have heat-resistant layer with a heat resistance temperature which is equal to or higher than a temperature at which the sealing member is cured by heating.