In-Zn-Sn Oxide Semiconductor Layer for Thin-Film Transistors

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Solution Overview

Problem

Oxide semiconductor layers for thin-film transistors face challenges in achieving high electronic carrier concentration, switching characteristics, high sputtering rates, and preventing residue formation during wet etching, particularly with IZTO films, which often result in degraded ON-current and elevated Subthreshold Swing values.

Innovation Solution

An In-Zn-Sn-based oxide semiconductor layer with specific atomic ratios of In, Zn, and Sn, formed by a sputtering method under controlled oxygen partial pressure, is used to achieve optimal TFT characteristics, high sputtering rates, and prevent residue formation during wet etching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If IZTO semiconductor is used as a semiconductor layer for thin-film transistor, then high electronic carrier concentration is achieved, but switching properties (transistor characteristics) are degraded

Engineering Contradiction:
Improveelectronic carrier concentrationVSAvoidswitching properties
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies parameter changes by precisely controlling the atomic composition ratios of In, Zn, and Sn in the IZTO semiconductor layer. By optimizing these compositional parameters within specific ranges, the patent achieves both high electronic carrier concentration and good switching properties, resolving the contradiction between quantity of charge carriers and device reliability.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If sputtering method is used to form oxide semiconductor layer, then film formability at low temperatures is achieved, but sputtering rate is reduced

Engineering Contradiction:
Improvefilm formation temperatureVSAvoidsputtering rate
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent resolves this contradiction by optimizing sputtering process parameters including oxygen partial pressure, sputtering power, and gas flow rates. By carefully controlling these parameters, the patent achieves low-temperature film formation while maintaining acceptable sputtering rates, allowing both low temperature processing and reasonable productivity.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If wet etching is performed on IZTO film, then patterning is achieved, but residue formation occurs

Engineering Contradiction:
Improvepatterning capabilityVSAvoidresidue formation
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by optimizing the local composition of the IZTO film, particularly controlling the Sn content and distribution. By adjusting the compositional quality of the semiconductor layer, the patent improves etch selectivity and reduces residue formation during wet etching, while maintaining the desired patterning capability.

Inventive Principle:
Principle #3Local quality

4Speed

If high In content is used in IZTO semiconductor, then carrier mobility is improved, but threshold voltage becomes negative

Engineering Contradiction:
Improvecarrier mobilityVSAvoidthreshold voltage stability
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent resolves this contradiction by precisely controlling the In content parameter within a specific range and balancing it with Zn and Sn contents. By optimizing this compositional parameter, the patent maintains high carrier mobility while preventing excessive negative threshold voltage, ensuring stable transistor characteristics.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The In-Zn-Sn-based oxide semiconductor layer provides thin-film transistors with excellent switching characteristics, high sputtering rates, and no residue formation during wet etching, enhancing the performance and yield of display devices.

Implementation Method 1

formed by a sputtering method under controlled oxygen partial pressure

Methodology Applied
Scientific EffectSputtering: Sputtering

Data Source

PatentUS10256091B2Oxide for semiconductor layer of thin-film transistor, semiconductor layer of thin-film transistor having said oxide, and thin-film transistor
Publication Date: 2019.04.09 SAMSUNG DISPLAY CO LTD
  • US10256091B2 patent drawing
  • US10256091B2 patent drawing
  • US10256091B2 patent drawing

AI summary

The oxide of the present invention for thin-film transistors is an In—Zn—Sn-based oxide containing In, Zn, and Sn, wherein when the respective contents (atomic %) of metal elements contained in the In—Zn—Sn-based oxide are expressed by [Zn], [Sn], and [In], the In—Zn—Sn-based oxide fulfills the following expressions (2) and (4) when [In]/([In]+[Sn])≤0.5; or the following expressions (1), (3), and (4) when [In]/([In]+[Sn])>0.5.[In]/([In]+[Zn]+[Sn])≤0.3  (1),[In]/([In]+[Zn]+[Sn])≤1.4×{[Zn]/([Zn]+[Sn])}−0.5  (2),[Zn]/([In]+[Zn]+[Sn])≤0.83  (3),and0.1≤[In]/([In]+[Zn]+[Sn])  (4).According to the present invention, oxide thin films for thin-film transistors can be obtained, which provide TFTs with excellent switching characteristics, and which have high sputtering rate in the sputtering and properly controlled etching rate in the wet etching.