In-Zn-Sn Oxide Semiconductor Layer for Thin-Film Transistors
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Solution Overview
Problem
Oxide semiconductor layers for thin-film transistors face challenges in achieving high electronic carrier concentration, switching characteristics, high sputtering rates, and preventing residue formation during wet etching, particularly with IZTO films, which often result in degraded ON-current and elevated Subthreshold Swing values.
Innovation Solution
An In-Zn-Sn-based oxide semiconductor layer with specific atomic ratios of In, Zn, and Sn, formed by a sputtering method under controlled oxygen partial pressure, is used to achieve optimal TFT characteristics, high sputtering rates, and prevent residue formation during wet etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If IZTO semiconductor is used as a semiconductor layer for thin-film transistor, then high electronic carrier concentration is achieved, but switching properties (transistor characteristics) are degraded
Solution Approach 1:
The patent applies parameter changes by precisely controlling the atomic composition ratios of In, Zn, and Sn in the IZTO semiconductor layer. By optimizing these compositional parameters within specific ranges, the patent achieves both high electronic carrier concentration and good switching properties, resolving the contradiction between quantity of charge carriers and device reliability.
2Temperature
If sputtering method is used to form oxide semiconductor layer, then film formability at low temperatures is achieved, but sputtering rate is reduced
Solution Approach 1:
The patent resolves this contradiction by optimizing sputtering process parameters including oxygen partial pressure, sputtering power, and gas flow rates. By carefully controlling these parameters, the patent achieves low-temperature film formation while maintaining acceptable sputtering rates, allowing both low temperature processing and reasonable productivity.
3Ease of manufacture
If wet etching is performed on IZTO film, then patterning is achieved, but residue formation occurs
Solution Approach 1:
The patent applies local quality by optimizing the local composition of the IZTO film, particularly controlling the Sn content and distribution. By adjusting the compositional quality of the semiconductor layer, the patent improves etch selectivity and reduces residue formation during wet etching, while maintaining the desired patterning capability.
4Speed
If high In content is used in IZTO semiconductor, then carrier mobility is improved, but threshold voltage becomes negative
Solution Approach 1:
The patent resolves this contradiction by precisely controlling the In content parameter within a specific range and balancing it with Zn and Sn contents. By optimizing this compositional parameter, the patent maintains high carrier mobility while preventing excessive negative threshold voltage, ensuring stable transistor characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The In-Zn-Sn-based oxide semiconductor layer provides thin-film transistors with excellent switching characteristics, high sputtering rates, and no residue formation during wet etching, enhancing the performance and yield of display devices.
Implementation Method 1
formed by a sputtering method under controlled oxygen partial pressure
Data Source
AI summary
The oxide of the present invention for thin-film transistors is an In—Zn—Sn-based oxide containing In, Zn, and Sn, wherein when the respective contents (atomic %) of metal elements contained in the In—Zn—Sn-based oxide are expressed by [Zn], [Sn], and [In], the In—Zn—Sn-based oxide fulfills the following expressions (2) and (4) when [In]/([In]+[Sn])≤0.5; or the following expressions (1), (3), and (4) when [In]/([In]+[Sn])>0.5.[In]/([In]+[Zn]+[Sn])≤0.3 (1),[In]/([In]+[Zn]+[Sn])≤1.4×{[Zn]/([Zn]+[Sn])}−0.5 (2),[Zn]/([In]+[Zn]+[Sn])≤0.83 (3),and0.1≤[In]/([In]+[Zn]+[Sn]) (4).According to the present invention, oxide thin films for thin-film transistors can be obtained, which provide TFTs with excellent switching characteristics, and which have high sputtering rate in the sputtering and properly controlled etching rate in the wet etching.


