I/O Expander Controlled Memory Hot Swap Circuit
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Solution Overview
Problem
Conventional computing systems with hot swap capabilities are often not suitable for low-cost and small form factor systems due to the need for dedicated controllers and complex circuitry, making them inaccessible to lower-end systems.
Innovation Solution
A system comprising a chipset, I/O expander, power transistor, and voltage regulator that allows for the selective control of power to memory modules, enabling hot swapping by using an I/O expander to transmit interrupts and control power transistors, thereby supporting memory hot swap operations without the need for complex circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If dedicated controllers and complex circuitry are used to support hot swap capability, then memory hot swap functionality is achieved, but device complexity and cost increase
Solution Approach 1:
The patent applies universality by enabling the existing memory controller to perform multiple functions - both normal memory operation and hot swap control - without requiring dedicated hot swap controllers. The memory controller is configured to receive hot swap commands and coordinate power management, allowing one component to serve universal purposes and eliminating the need for separate dedicated circuitry.
Solution Approach 2:
The patent merges the hot swap control functionality into the existing memory controller and power management infrastructure. By combining hot swap command handling, power transmission control, and memory management into integrated circuitry that already exists in the system, the patent eliminates the need for separate dedicated controllers and reduces overall device complexity.
2Adaptability or versatility
If dedicated controllers and complex circuitry are used to support hot swap capability, then memory hot swap functionality is achieved, but system cost increases
Solution Approach 1:
The patent applies universality by enabling the existing memory controller to perform multiple functions - both normal memory operation and hot swap control - without requiring dedicated hot swap controllers. The memory controller is configured to receive hot swap commands and coordinate power management, allowing one component to serve universal purposes and eliminating the need for separate dedicated circuitry.
Solution Approach 2:
The patent merges the hot swap control functionality into the existing memory controller and power management infrastructure. By combining hot swap command handling, power transmission control, and memory management into integrated circuitry that already exists in the system, the patent eliminates the need for separate dedicated controllers and reduces overall device complexity.
3Reliability
If power control signals are continuously monitored and transmitted, then safe hot swap operation is ensured, but energy consumption increases
Solution Approach 1:
The patent applies periodic action by using event-driven power control signals that are transmitted only when needed - specifically when hot swap commands are issued or power state changes occur. The memory controller and I/O expander engage in periodic communication cycles, with power control signals sent in response to specific events rather than continuous monitoring, thereby ensuring safe hot swap operation while minimizing energy consumption during idle periods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables hot swapping of memory modules in low-cost and small form factor systems by simplifying the control of power transmission, making it feasible for systems that previously lacked this capability.
Implementation Method 1
controlling a power transistor to prevent transmission of the regulated power from the voltage regulator to the memory module
Implementation Method 2
a voltage regulator to provide regulated power to a memory module
Data Source
AI summary
A system may include a motherboard, a chipset coupled to the motherboard, a memory module mount coupled to the chipset, a power transistor electrically coupled to the memory module mount, a voltage regulator to provide power to the power transistor, and an I/O expander coupled to the motherboard. The I/O expander is to receive instructions from the chipset to selectively control the power transistor to provide the power to the memory module mount.


