Interactive Cross-Domain I/O Pad Placement Optimization
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Solution Overview
Problem
The existing methods for integrated circuit (IC) design face inefficiencies in the process of I/O pad placement optimization, particularly due to slow data exchange between IC design tools and packaging tools, requiring time-consuming iterations and lacking real-time feedback on design changes.
Innovation Solution
The implementation of an interactive cross-domain package-driven I/O planning and placement optimization system, which allows for simultaneous object manipulation and placement across multiple electronic design automation (EDA) tool sessions, utilizing tentative locations, fuzzy logic, and constraint adjustments to optimize I/O pad placement concurrently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional batch-type optimization with iterative data exchange between IC design tool and packaging tool is used, then I/O pad placement can be optimized, but the process is time-consuming and lacks real-time feedback
Solution Approach 1:
The patent implements a feedback mechanism where the packaging tool provides real-time feedback on I/O pad placement constraints and routing feasibility to the IC design tool during the design process. This allows designers to adjust I/O pad locations interactively based on package-level constraints, eliminating the need for time-consuming batch iterations while maintaining placement optimization accuracy.
Solution Approach 2:
The patent introduces an intermediary data exchange mechanism that enables real-time communication between the IC design tool and packaging tool. This intermediary layer allows for efficient transfer of I/O pad placement information, tentative locations, and routing constraints, facilitating concurrent optimization without the delays of traditional batch processing.
2Reliability
If I/O pad placement is optimized considering package-level constraints, then routing feasibility improves, but the complexity of coordinating between IC design tool and packaging tool increases
Solution Approach 1:
The patent implements a universal data exchange framework that handles multiple functions (constraint validation, tentative location sharing, routing feasibility analysis) through a single integrated mechanism. This multi-functional approach reduces the complexity of tool coordination by consolidating various interaction requirements into a unified real-time feedback system.
Solution Approach 2:
The patent employs preliminary action by having the packaging tool analyze routing feasibility and provide constraints before final I/O pad placement is determined. This advance analysis allows the IC design tool to adjust placements proactively, reducing the need for complex iterative coordination while ensuring routing feasibility from the outset.
3Productivity
If real-time interactive optimization is implemented across multiple EDA tool sessions, then design efficiency improves, but the system complexity and computational requirements increase
Solution Approach 1:
The patent uses an intermediary data exchange mechanism that manages real-time communication between multiple EDA tool sessions. This intermediary layer handles the complexity of coordinating updates, maintaining consistency, and managing computational resources, thereby enabling real-time interactive optimization without proportionally increasing overall system complexity.
Solution Approach 2:
The patent implements a copying mechanism where tentative I/O pad locations and placement data are replicated and shared between the IC design tool and packaging tool in real-time. This copying approach allows both tools to work with consistent data simultaneously, improving design efficiency while avoiding the need for complex synchronization protocols.
Data Source
AI summary
Disclosed are a method, a system, and a computer program product for implementing interactive cross-domain package driven I/O planning and placement optimization of an electronic circuit design. In some embodiments, the method identifies an object on a first EDA tool session, determines a drop location for the first object based on a tentative location in the first EDA tool session, places the first object at the drop location, and adjusts the drop location via a second EDA tool session, performs placement or routing of a portion of the design. The method or the system further comprises placing a corresponding first object in the second EDA tool session, initiating the second EDA tool session object move in the first EDA tool session, determining whether a constraint is satisfied.