3D IC I/O Protection Circuit for Antenna Effect Damage

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Solution Overview

Problem

The antenna effect in IC manufacturing, where electrical charges accumulate during plasma operations, leading to damage of gate dielectric materials and transistors, particularly during the formation of Through Substrate Vias in 3D IC integration, necessitates effective protection mechanisms to prevent damage to functional transistors.

Innovation Solution

Incorporating an antenna effect protection circuit with both P-type and N-type transistors, where the gate, source, and drain of each transistor are electrically coupled, forming diode structures that protect functional transistors from damage during manufacturing, and optimizing the layout to improve chip area efficiency and reduce routing efforts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If antenna effect protection circuits are incorporated to prevent transistor damage during plasma operations, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improvetransistor protection from antenna effectVSAvoidprotection circuit structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines P-type and N-type transistors into a unified protection circuit structure where both transistor types work together to provide comprehensive antenna effect protection. The gates, sources, and drains of both transistor types are electrically coupled to form an integrated protection mechanism that leverages the complementary characteristics of P-type and N-type transistors.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The protection circuit serves multiple functions: it protects against antenna effect during plasma operations, provides electrostatic discharge protection, and maintains circuit functionality. The dual-transistor configuration enables the circuit to handle both positive and negative voltage spikes, making it a universal protection solution for various plasma processing scenarios.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If P-type and N-type transistors are both used in the protection circuit, then protection effectiveness is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveprotection effectivenessVSAvoidtransistor fabrication consistency
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies different transistor types (P-type and N-type) in specific locations within the protection circuit to optimize local protection characteristics. Each transistor type is strategically positioned and configured to handle specific voltage polarities, with their electrical couplings designed to create complementary protection zones that together provide comprehensive coverage.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If standard cell libraries are used for layout generation, then ease of manufacture is improved, but adaptability to specific protection requirements decreases

Engineering Contradiction:
Improvelayout generation processVSAvoidprotection circuit customization
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The protection circuit is designed as a modular structure that can be segmented into standard cell components suitable for library storage and retrieval. The circuit can be divided into functional blocks (P-type transistor section, N-type transistor section, electrical coupling elements) that can be independently optimized while maintaining overall functionality. This segmentation enables the use of automated place-and-route tools while preserving customization capability.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents transistor damage from the antenna effect, enhances chip area efficiency, and reduces routing efforts in IC design and manufacturing by using both P-type and N-type transistors in the protection circuit, ensuring reliable operation and improved manufacturing processes.

Implementation Method 1

The antenna effect in IC manufacturing, where electrical charges accumulate during plasma operations, leading to damage of gate dielectric materials and transistors

Methodology Applied
Scientific EffectAntenna effect: Electrostatic Induction

Data Source

PatentUS20240363558A1Integrated circuit device
Publication Date: 2024.10.31 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240363558A1 patent drawing
  • US20240363558A1 patent drawing
  • US20240363558A1 patent drawing

AI summary

An integrated circuit (IC) device includes a first die, and a second die coupled to the first die through an input/output (I/O) terminal. The first die includes a first antenna effect protection circuit electrically coupled to the I/O terminal. The first antenna effect protection circuit includes at least one first transistor of a first type, and at least one second transistor of a second type different from the first type. A gate terminal, a first terminal and a second terminal of each of the at least one first transistor and the at least one second transistor are electrically coupled together, and to the I/O terminal.