Multi-Device I/O Terminal Shared Conductor Architecture

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Solution Overview

Problem

Industrial process control and automation systems face inefficiencies due to underutilization of hardware in I/O modules, limited I/O channel density, and thermal management issues, as universal or reconfigurable I/O channels typically use only analog or digital components at a time, leading to higher costs and space requirements.

Innovation Solution

The implementation of a method and apparatus that allows multiple electrical signals to be generated using independent power supplies and transmitted through a common electrical conductor to multiple devices via an I/O terminal, enabling simultaneous operation of multiple I/O channels without significant interference, thereby increasing channel density without additional circuitry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple I/O channels are connected through separate connections, then reliability and ease of operation are improved, but device complexity and space requirements increase

Engineering Contradiction:
ImproveI/O channel reliabilityVSAvoidI/O module complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple I/O channel connections into a single shared electrical conductor, allowing multiple devices to be connected through one physical connection rather than requiring separate conductors for each channel. This merging approach reduces the number of physical connections and terminal blocks needed while maintaining the ability to independently communicate with each device through the shared conductor.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shared electrical conductor serves multiple functions by carrying signals for multiple different I/O channels simultaneously. The single conductor becomes a universal communication path that can be used by various devices and channels, eliminating the need for dedicated conductors for each channel and reducing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If universal or reconfigurable I/O channels are implemented, then adaptability is improved, but manufacturing cost and device complexity increase due to underutilization of hardware

Engineering Contradiction:
ImproveI/O channel adaptabilityVSAvoidManufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent implements universal I/O channels that can be configured to communicate with different types of devices (analog, digital, discrete, etc.) through a single shared conductor. The hardware remains the same while the communication protocol and configuration can be adapted to suit different device types, eliminating the need for multiple specialized hardware variants and reducing manufacturing costs.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system achieves adaptability by changing operational parameters such as communication protocols, signal configurations, and device addresses rather than requiring physical hardware changes. This allows the same I/O module and shared conductor to serve multiple device types by adjusting software and configuration parameters.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If additional circuitry is added to increase I/O channel density, then channel density is improved, but device complexity and thermal management issues worsen

Engineering Contradiction:
ImproveI/O channel densityVSAvoidCircuitry complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent increases I/O channel density by merging multiple channels into a single shared electrical conductor. Instead of adding separate physical circuitry for each channel, the system combines channel communications over the shared conductor, allowing more channels to be supported without proportionally increasing physical circuitry or terminal connections.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system achieves higher channel density by utilizing the temporal and logical dimensions rather than just spatial dimensions. Multiple channels share the same physical conductor through time-division or protocol-based multiplexing, effectively adding channels in the logical domain rather than requiring proportional increases in physical space and circuitry.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11327459B2Multi-device connections for input/output (I/O) terminals
Publication Date: 2022.05.10 HONEYWELL INTERNATIONAL INC
  • US11327459B2 patent drawing
  • US11327459B2 patent drawing
  • US11327459B2 patent drawing

AI summary

An apparatus includes multiple circuit paths configured to generate multiple electrical signals to be used to communicate with multiple devices. Each of the circuit paths is configured to use electrical energy from a different one of multiple independent power supplies. The apparatus also includes an I/O terminal configured to be coupled to a common electrical conductor that is coupled to the multiple devices. The I/O terminal is configured to pass the electrical signals to the common electrical conductor. The apparatus is configured to use each of the electrical signals to one of: receive input data from one of the multiple devices or provide output data to one of the multiple devices.