Focused Ion Beam Cross-Section Imaging for Specific Layer Detection

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Accurate detection of a specific layer in a layered sample is challenging due to the need for precise etching and observation, which existing technologies struggle to achieve effectively.

Innovation Solution

A machining method involving the use of a focused ion beam to process the cross-section of a sample, followed by electron beam irradiation to generate observation images, and a specific layer determination step using a learning model to accurately identify the exposure of the specific layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a focused ion beam is used to etch the sample cross-section, then the specific layer can be exposed, but the detection precision of the specific layer remains insufficient

Engineering Contradiction:
Improvedetection precision of specific layerVSAvoiddifficulty of detecting specific layer
Core Design Contradiction:
Measurement precisionVSDifficulty of detecting and measuring

Solution Approach 1:

The patent introduces an electron beam as an intermediary tool between the ion beam etching process and the specific layer detection. The electron beam performs secondary electron emission imaging to visualize the cross-section and identify the specific layer, while the ion beam continues to perform the primary etching function. This intermediary imaging mechanism resolves the contradiction by enabling precise detection without compromising the etching capability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent implements a feedback mechanism where the imaging results from electron beam irradiation are used to determine whether the specific layer has been exposed, and this information feeds back to control the continuation or termination of the ion beam etching process. The determination unit analyzes the imaging data and provides feedback signals to adjust the machining parameters, thereby achieving precise detection and controlled exposure of the specific layer.

Inventive Principle:
Principle #23Feedback

2Measurement precision

If the electron beam is focused before machining, then the observation image quality improves, but the machining time increases

Engineering Contradiction:
Improveobservation image qualityVSAvoidmachining time
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent applies preliminary action by focusing the electron beam before the ion beam machining begins. The electron beam is focused in advance to ensure that when imaging is performed during or after etching, the observation image quality is already optimized. This preliminary focusing action eliminates the need for time-consuming refocusing operations during the machining process, thereby improving productivity while maintaining high image quality.

Inventive Principle:
Principle #10Preliminary action

3Measurement precision

If the machining step and image generation step are executed separately, then the detection accuracy improves, but the overall processing time increases

Engineering Contradiction:
Improvedetection accuracyVSAvoidprocessing time
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent implements continuity of useful action by enabling the electron beam imaging process to occur concurrently with or immediately following the ion beam etching process without significant interruption. The system continuously performs etching while periodically acquiring imaging data, or performs a brief imaging step immediately after etching completion. This continuous operation maintains high detection accuracy while minimizing idle time, thereby improving overall processing efficiency.

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables accurate and precise detection of the specific layer, allowing for effective exposure and observation, thereby overcoming the limitations of existing technologies.

Implementation Method 1

a machining step of processing a cross-section of a sample in which a plurality of layers is laminated by a predetermined amount by irradiating the sample with a focused ion beam

Methodology Applied
Scientific EffectIon beam: Ion Beam

Implementation Method 2

an image generation step of generating an observation image of the cross-section of the sample by irradiating the sample with an electron beam

Methodology Applied
Scientific EffectElectron beam: Electron Beam

Data Source

PatentUS20250140518A1Machining method and charged particle beam device
Publication Date: 2025.05.01 HITACHI HIGH TECH ANALYSIS CORP
  • US20250140518A1 patent drawing
  • US20250140518A1 patent drawing
  • US20250140518A1 patent drawing

AI summary

This machining method includes: a machining step of irradiating a sample constituted from a stack of multiple layers with a focused ion beam so as to machine a cross-section of the sample by a predetermined amount; an image generation step of generating an observation image of the cross-section of the sample by irradiating the sample with an electron beam after the machining step is ended; and a specific-layer determination step of determining whether a specific layer of the multiple layers is exposed based on the observation image.