Ion Beam Sputtering Target Assembly Adhesive Drop Method
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for assembling ion beam sputtering targets on support plates face challenges in achieving uniform thickness and thermal shock resistance, with difficulties in adjusting glue layer thickness and gas trapping issues under vacuum conditions, leading to suboptimal performance and high costs.
Innovation Solution
A method involving the deposition of adhesive material drops on one plate, application of a grid with predefined thickness, and uniform pressure to ensure contact without air trapping, using a grid with openings that define the spacing to prevent percolation and ensure uniformity, employing a silicone elastomer glue that polymerizes in ambient conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a continuous layer of solder or glue is used to bond the target to the support plate, then bonding strength is achieved, but manufacturing complexity increases and cost rises due to difficulty in adjusting thickness and achieving uniformity
Solution Approach 1:
The continuous layer of adhesive material is segmented into discrete drops arranged in a matrix pattern. This segmentation simplifies the manufacturing process by eliminating the need for precise thickness control of continuous layers, while still achieving adequate bonding strength through the distributed array of adhesive points.
Solution Approach 2:
Instead of applying uniform adhesive properties across the entire bonding surface, the invention applies adhesive material locally in discrete drops at specific positions. This local application approach reduces manufacturing complexity while maintaining bonding effectiveness through strategic placement of adhesive material.
2Strength
If a glue layer is used to bond the target, then bonding is achieved, but gas trapping occurs under vacuum conditions leading to deterioration of seal solidity
Solution Approach 1:
The adhesive material is segmented into discrete drops rather than forming a continuous layer. This segmentation creates gaps between adhesive regions that allow trapped gas to escape or be minimized during vacuum processing, preventing bubble formation that would compromise seal integrity.
Solution Approach 2:
The array of discrete adhesive drops creates a porous or discontinuous bonding structure that allows gas permeation or escape paths, preventing gas entrapment during vacuum conditions while maintaining adequate bonding strength through the distributed adhesive points.
3Strength
If adhesive material is applied to achieve bonding, then bonding strength is obtained, but uniformity of thickness in the fastening zone is difficult to achieve
Solution Approach 1:
The adhesive application is segmented into discrete drops of controlled volume positioned at predetermined locations. This approach eliminates the difficulty of achieving uniform thickness in continuous layers, as each drop's volume and position can be independently controlled, ensuring consistent bonding characteristics across the fastening zone.
Solution Approach 2:
The invention changes the parameter of adhesive application from continuous layer thickness control to discrete drop volume and spacing control. This parameter transformation simplifies the achievement of uniformity, as drop volume and positioning are more easily controlled than continuous layer thickness, particularly in automated dispensing systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves high uniformity in the fastening zone, excellent thermal shock resistance, and cost-effective assembly, allowing for efficient sputtering processes with stable working pressures and high-quality thin film deposition.
Implementation Method 1
employing a silicone elastomer glue that polymerizes in ambient conditions
Data Source
AI summary
According to the method, drops of an adhesive material are deposited on one of the plates, with the drops being spaced from one another. A grid having a predefined thickness lower than that of the drops is applied to the plate receiving the drops. A perpendicular and uniform pressure is applied to at least one of the plates, so that the drops spread and come into contact with the opposing sides of the two plates. The spacing of the drops is defined so that after spreading under the pressure applied, air is not trapped between the drops.