Ion Beam Substrate Surface Modification for AR Glass

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Solution Overview

Problem

Current methods for producing high-refractive-index optical glasses for augmented reality imaging systems are inefficient, leading to issues with planarity, flatness, and chemical alterations during polishing, resulting in unwanted thickness variations and optical property changes.

Innovation Solution

A method using a particle beam, such as an ion beam, to modify specific regions of multicomponent glass substrates, allowing for precise material removal and surface refinement without chemical alteration, enabling rapid and precise adjustment of thickness and surface quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If chemical-mechanical polishing is used to achieve required thickness and surface quality, then manufacturing precision is improved, but processing time increases and chemical alterations occur on the substrate surface

Engineering Contradiction:
Improvethickness uniformity and surface flatnessVSAvoidprocessing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent replaces the chemical-mechanical polishing system with a pure mechanical abrasion system using suspended abrasive particles. This substitution eliminates the chemical alteration component while maintaining the mechanical surface refinement function, thereby reducing processing time without compromising thickness uniformity or surface flatness

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the processing parameters by controlling abrasive particle size distribution, suspension concentration, and flow dynamics. By optimizing these parameters, the system achieves the required manufacturing precision (thickness uniformity and surface flatness) while significantly reducing processing time compared to conventional chemical-mechanical polishing

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If chemical-mechanical polishing is used to refine substrate surfaces, then surface quality is improved, but chemical alterations occur on the substrate surface affecting optical properties

Engineering Contradiction:
Improvesurface flatnessVSAvoidchemical alterations on substrate surface
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent substitutes the chemical-mechanical polishing process with a purely mechanical abrasion process using suspended abrasive particles in a fluid medium. This replacement maintains the surface flatness improvement function while eliminating the chemical alteration harmful effect, preserving the original optical properties of the substrate surface

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts and removes the chemical component from the polishing process, retaining only the mechanical abrasion function. By separating the chemical and mechanical functions and eliminating the chemical aspect, the system achieves surface flatness improvement without introducing chemical alterations that would affect optical properties

Inventive Principle:
Principle #2Taking out (Extraction)

3Loss of substance

If marginal regions of substrates are subjected to greater ablation during polishing, then material removal is achieved, but parallelism of surfaces deteriorates

Engineering Contradiction:
Improvematerial removalVSAvoidparallelism of surfaces
Core Design Contradiction:
Loss of substanceVSManufacturing precision

Solution Approach 1:

The patent implements feedback control by continuously monitoring substrate thickness and surface topology during the abrasion process, and dynamically adjusting process parameters accordingly. This feedback mechanism ensures uniform material removal across the substrate surface, maintaining parallelism while achieving the required thickness reduction

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent employs dynamic process control where abrasion parameters such as particle concentration, flow velocity, and applied pressure are continuously adjusted during processing. This dynamic adaptation prevents excessive ablation at marginal regions, ensuring uniform material removal and preserving surface parallelism throughout the substrate

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach maintains the original chemical surface properties, reduces thickness variations, and improves surface quality, enhancing the optical properties of the substrates while minimizing processing time and the need for reworking.

Implementation Method 1

modifying at least one region of a surface and/or one portion of a substrate by exposure to the particle beam

Methodology Applied
Scientific EffectAblation: Ablation

Implementation Method 2

providing an apparatus having a radiation source for generating a particle beam; modifying the region of the surface and/or the portion of the substrate by exposure to the particle beam

Methodology Applied
Scientific EffectIon Beam: Ion Beam

Data Source

PatentUS20230102394A1Substrate and method for modifying at least one region of a surface or a portion of a substrate
Publication Date: 2023.03.30 SCHOTT AG
  • US20230102394A1 patent drawing
  • US20230102394A1 patent drawing

AI summary

A method for physically modifying at least one of at least one region of a surface of a substrate and at least one portion of the substrate, the substrate comprising a multicomponent glass, the method comprising the steps of: providing an apparatus and the substrate, the apparatus including a radiation source configured for generating a particle beam; feeding the substrate to the apparatus and applying a vacuum; modifying at least one of the at least one region of the surface of the substrate and the at least one portion of the substrate by an exposure to the particle beam.