Ion-Conducting Tool for Localized Metal Ion Deposition
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Solution Overview
Problem
Existing methods for treating metallic substrate surfaces require complex, expensive equipment and present safety and disposal challenges, such as high technical costs and environmental issues, especially in material deposition and removal processes.
Innovation Solution
A method using an ion-conducting solid tool that selectively conducts metal ions from or to the substrate surface through electrochemical processes, allowing for local material deposition or removal without the need for large devices, by applying an electrical potential and utilizing materials like copper rubidium chloride or Pyrex glass, which can transport metal ions without degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If material deposition or removal processes are used to treat metallic substrate surfaces, then the necessary process conditions can be achieved, but large, complex, and expensive devices are required
Solution Approach 1:
The patent replaces complex mechanical deposition systems (vacuum chambers, sputtering equipment) and chemical etching systems (chemical baths, flow control devices) with a simple electrochemical system consisting of a power supply, ion-conducting material, and electric field. This substitution achieves material deposition and removal through electrochemical reactions driven by applied voltage, eliminating the need for large vacuum chambers and complex mechanical apparatus while maintaining manufacturing precision.
Solution Approach 2:
The patent extracts and utilizes only the essential electrochemical functionality from complex deposition and etching systems. By isolating the core material transfer mechanism (ion conduction through solid electrolytes) and removing unnecessary components (vacuum systems, chemical bath circulation, temperature control apparatus), the invention achieves surface treatment with minimal equipment while preserving manufacturing precision.
2Manufacturing precision
If wet-chemical deposition processes and etching processes are used, then material can be deposited or removed, but high technical cost and safety problems arise
Solution Approach 1:
The patent replaces wet-chemical processes with electrochemical processes. Instead of using chemical baths requiring circulation pumps, temperature control, and safety infrastructure, the invention uses solid ion-conducting materials with applied electric fields to achieve material deposition and removal. This eliminates chemical handling costs, safety equipment requirements, and complex process control while maintaining surface treatment quality.
Solution Approach 2:
The patent employs simple, inexpensive ion-conducting materials (such as solid electrolytes or ion-conducting ceramics) that can be easily replaced if degraded, rather than investing in expensive, complex chemical processing equipment. The low cost of consumable ion-conducting materials significantly reduces overall process cost while eliminating safety hazards associated with chemical baths.
3Manufacturing precision
If chemical baths are provided for deposition and etching processes, then material processing can be performed, but safety and disposal problems occur
Solution Approach 1:
The patent substitutes chemical bath processes with electrochemical processes using solid ion-conducting materials. This eliminates the need for liquid chemicals, thereby removing safety hazards such as chemical burns, inhalation risks, and environmental contamination from chemical disposal. The electrochemical process uses only electricity and solid materials, dramatically improving safety and environmental compatibility while maintaining surface treatment precision.
4Manufacturing precision
If conventional material removal or deposition methods are used, then surface treatment can be achieved, but the processes require large and expensive devices
Solution Approach 1:
The patent extracts the essential material transfer mechanism from large-scale deposition and etching equipment, isolating the core electrochemical reaction to a compact configuration. By using solid ion-conducting materials with direct electric field application, the invention reduces equipment volume from large vacuum chambers and chemical processing tanks to a simple power supply and small ion-conducting component, while maintaining surface treatment quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, controlled material deposition or removal on metallic substrates without chemical side-products, maintaining tool integrity and avoiding mechanical stress, suitable for producing highly plane surfaces and micro/nano structures without the need for abrasive agents or complex setups.
Implementation Method 1
an ion-conducting material which is brought into contact at least in some regions with the metallic surface of the substrate... The ion-conducting material of the tool is selected in such a manner that it is able to conduct metal ions of copper, silver or from a silver and copper alloy of the substrate surface
Implementation Method 2
an electrical potential is applied between the substrate surface and the tool so that the metal ions are drawn from the substrate surface by the tool or deposited on the substrate surface by the tool... the treatment of the surface substrate according to the invention is based on solely electrochemical processes
Data Source
AI summary
Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface. The tool conducts the metal ions of the substrate and an electric potential is applied so that an electrical potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool.