Ion Detector with Conversion Dynode and Avalanche Photodiode
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Solution Overview
Problem
Conventional ion detectors face challenges in improving detection accuracy due to afterglow from scintillators and complexity in structure, particularly in converting secondary electrons effectively.
Innovation Solution
An ion detector design that eliminates scintillators by using a conversion dynode with a negative potential and a semiconductor electron detector with an electron incident surface closer to the dynode, combined with an avalanche photodiode to enhance convergent properties of secondary electrons and reduce noise, thereby improving detection accuracy and simplifying the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If scintillators are used to convert secondary electrons to light, then detection capability is achieved, but afterglow occurs which deteriorates detection accuracy
Solution Approach 1:
The patent extracts and removes the scintillator component from the detection system. By directly detecting secondary electrons with a semiconductor electron detector, the harmful afterglow effect is eliminated while maintaining detection capability through a different physical mechanism (direct electron detection rather than light conversion)
Solution Approach 2:
The patent replaces the optical conversion mechanism (scintillator converting electrons to light) with a direct electronic detection mechanism (semiconductor detector directly detecting electrons). This substitution eliminates the intermediate light conversion step that causes afterglow
2Manufacturing precision
If the electron incident surface is located closer to the conversion dynode, then the convergent property of secondary electrons is increased, but the distance reduction must be achieved without compromising detector support structure
Solution Approach 1:
The patent positions the electron incident surface in a different spatial dimension relative to the conversion dynode, specifically placing it closer in the electron trajectory direction while using a stem structure to provide support from a different spatial location, thus achieving both short distance and proper support
3Speed
If the semiconductor electron detector is downsized to improve response characteristics, then detection speed is improved, but the detector area is reduced which may affect electron collection efficiency
Solution Approach 1:
The patent applies local quality by concentrating the detection function at the electron incident surface which is positioned optimally close to the conversion dynode. The stem structure provides support without interfering with the localized electron collection area, allowing small detector size while maintaining collection efficiency through optimal spatial positioning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases the convergent property of secondary electrons, allows for a downsized detector, enhances response characteristics, and improves the signal-to-noise ratio, leading to improved detection accuracy and structural simplification.
Implementation Method 1
convention ion detectors including conversion dynodes that emit secondary electrons by ion collisions
Implementation Method 2
the semiconductor electron detector may be an avalanche photodiode
Data Source
AI summary
An ion detector 1A for detecting positive ions is provided with a chamber 2 having an ion entrance 3 which allows positive ions to enter, a conversion dynode 9 which is disposed in the chamber 2 and to which a negative potential is applied, and an avalanche photodiode 30 that is disposed in the chamber 2 and has an electron incident surface 30a which is opposed to the conversion dynode 9 and also into which secondary electrons emitted from the conversion dynode 9 are made incident. The electron incident surface 30a is located closer to the conversion dynode 9 than a positioning part 14 which supports the avalanche photodiode 30 in the grounded chamber 2.


