Ion Milling Device Magnetic Particle Redirection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In cross-section milling using an ion milling device, fine particles sputtered by the ion beam reattach to the milling surface, making it difficult to observe the surface with a scanning electron microscope due to contamination, and existing cooling mechanisms are ineffective for all processing scenarios.
Innovation Solution
The ion milling device incorporates an ion source, a chamber, a sample table, a shielding plate, and strategically placed permanent magnets to attract and redirect sputtered particles away from the processing surface, utilizing magnetic forces to minimize reattachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a cooling mechanism is used to reduce reattachment of sputtered particles, then particle reattachment is reduced, but the device complexity increases and it is not effective for all processing scenarios
Solution Approach 1:
The patent extracts the magnetic field generation function from the complex cooling mechanism and implements it through simple permanent magnets placed near the sample surface. This removes the harmful reattachment effect without requiring complex thermal management systems, making the solution applicable to all processing scenarios regardless of cooling requirements
Solution Approach 2:
The patent replaces the mechanical/thermal cooling system with a magnetic field-based system using permanent magnets. Instead of using complex cooling mechanisms to prevent particle reattachment, the invention uses magnetic fields to redirect sputtered particles away from the sample surface, achieving the same protective effect with a simpler, more versatile system
2Productivity
If ion beam irradiation is applied to process the sample, then the sample can be milled, but fine particles are sputtered and reattach to the surface causing contamination
Solution Approach 1:
The patent converts the harmful effect of sputtered particles into a beneficial one by using the magnetic field to redirect these particles away from the sample surface. The same ion beam that causes particle sputtering is now complemented by a magnetic field that prevents reattachment, transforming the contamination problem into a controlled particle management system that maintains milling efficiency while preventing surface contamination
Solution Approach 2:
The patent introduces a magnetic field as an intermediary between the ion beam and the sample surface. This magnetic field acts as a mediator that intercepts sputtered particles and redirects them away from the sample, preventing direct reattachment while allowing the ion beam milling process to continue efficiently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the reattachment of fine particles to the ion milling surface, allowing for clearer observation of the processed sample with a scanning electron microscope by effectively managing ion beam-induced contamination.
Implementation Method 1
a magnet disposed in the chamber are provided... utilizing magnetic forces to minimize reattachment
Implementation Method 2
a sputtering phenomenon in which an ion beam having a uniform energy and direction is accelerated to irradiate the sample and the sample atoms are blown off from the sample surface
Data Source
AI summary
An object of the present invention is to provide a technique for reducing a phenomenon in which fine particles derived from a sample and bounced off by ion beam irradiation are reattached to an ion milling surface. An ion milling device of the invention includes an ion source which emits an ion beam, a chamber, a sample table in which a sample is placed in the chamber, and a shielding plate placed on the sample, and by having a magnet disposed in the chamber, reattachment of fine particles derived from the sample can be reduced.