Ion Milling Device Position Adjustment Mechanism
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Solution Overview
Problem
The ion milling device faces challenges in maintaining processing accuracy and reproducibility due to attaching errors of the ion source, leading to shifts in the ion beam center and sample rotation center, which result in irregular surface processing and reduced precision, especially when forming inclined surfaces for observing three-dimensional structures.
Innovation Solution
An ion milling device equipped with an ion source position adjustment mechanism that allows precise adjustment of the ion source's position on the XY plane and in the Z direction, using a target plate with conductive material to detect ion beam current and adjust the ion source position for optimal processing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If the ion source is detached for cleaning and maintenance, then the ion beam irradiation unit can be cleaned, but attaching errors occur causing shifts in ion beam center position
Solution Approach 1:
The patent replaces mechanical alignment methods with an optical measurement system. A laser beam is used to define a reference axis, and a position detection device optically measures the ion beam center position relative to this reference, eliminating the need for mechanical alignment procedures after reattachment.
Solution Approach 2:
The patent introduces a laser beam as an intermediary reference and a position detection device as a mediator between the ion source and the measurement system. This intermediary optical reference system enables precise measurement of position shifts without direct mechanical contact or alignment.
2Manufacturing precision
If the ion beam center position shifts due to attaching error, then processing uniformity deteriorates, but recalibration is required
Solution Approach 1:
The patent replaces time-consuming mechanical recalibration procedures with rapid optical measurement. The position detection device provides immediate feedback on ion beam center position, allowing for quick identification and correction of shifts without lengthy mechanical adjustment processes.
Solution Approach 2:
The patent implements a feedback mechanism where the position detection device continuously monitors the ion beam center position and provides information for correction. This feedback loop enables rapid detection and compensation of position shifts, minimizing recalibration time and maintaining processing uniformity.
3Measurement precision
If a focused ion beam device is used to form inclined surfaces, then measurement precision in depth direction improves, but processing speed decreases
Solution Approach 1:
The patent makes the ion milling device multi-functional by enabling it to perform both high-speed surface processing with unfocused ion beams and high-precision depth measurement with focused ion beams. The same device can switch between processing modes depending on the operational requirements.
Solution Approach 2:
The patent introduces dynamic control of ion beam focusing, allowing the system to switch between focused and unfocused states. The focus control mechanism enables the ion beam to be dynamically adjusted based on whether the current task requires high-speed processing or high-precision measurement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves processing accuracy and reproducibility of the ion milling device, reducing maintenance time and ensuring consistent surface processing even after ion source detachment and reattachment.
Implementation Method 1
an ion beam irradiation unit that generates an ion beam and irradiates a sample (20) with the ion beam... sputters off an atom on the sample surface without stress by a sputtering phenomenon to smooth the sample surface
Implementation Method 2
a target plate having a conductive material 4 which detects a current of the ion beam
Data Source
AI summary
By irradiating a sample with an unfocused ion beam, processing accuracy of an ion milling device for processing a sample or reproducibility accuracy of a shape of a processed surface is improved. Therefore, the ion milling device includes a sample chamber, an ion source position adjustment mechanism provided at the sample chamber, an ion source attached to the sample chamber via the ion source position adjustment mechanism and configured to emit an ion beam, and a sample stage configured to rotate around a rotation center. When a direction in which the rotation center extends when an ion beam center of the ion beam matches the rotation center is set as a Z direction, and a plane perpendicular to the Z direction is set as an XY plane, the ion source position adjustment mechanism is capable of adjusting a position of the ion source on the XY plane and a position of the ion source in the Z direction.