Ion Optics Components Fabrication via Machining and Plating
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Solution Overview
Problem
Conventional mass spectrometers using metallic components are bulky, expensive, and difficult to miniaturize, with complex and labor-intensive assembly processes, and existing alternatives like semiconductor-based methods are limited in electrode geometry and require hazardous chemicals.
Innovation Solution
The method involves machining electrically isolating substrates to form electrode supports with non-parallel surfaces, creating gaps for segmented electrode structures, and plating to form electrode bodies with connecting traces, allowing for the assembly of ion optics components like quadrupole and hexapole ion guides with reduced alignment complexity and curved pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If metallic components are used with standard metal machining techniques, then manufacturing precision and reliability are maintained, but device size becomes large and bulky, and manufacturing cost increases
Solution Approach 1:
The patent changes the material parameter from metal to electrically isolating substrate (such as ceramic or plastic), enabling miniaturization while maintaining manufacturing precision through alternative fabrication processes like machining and plating that are suitable for non-metallic materials
Solution Approach 2:
The patent uses composite construction by combining electrically isolating substrate material with conductive plated surfaces to create electrode structures that provide both electrical functionality and mechanical support in a miniaturized format
2Device complexity
If metallic components are assembled using standard techniques, then structural strength is ensured, but assembly complexity and labor intensity increase
Solution Approach 1:
The patent merges multiple components into integrated electrode structures where the substrate, electrode supports, and electrode surfaces are combined into single assembled units, reducing the number of separate parts and assembly steps while maintaining structural integrity through unified construction
3Volume of moving object
If semiconductor-based methods are used, then device miniaturization is achieved, but electrode geometry flexibility is limited and hazardous chemicals are required
Solution Approach 1:
The patent changes the fabrication approach from semiconductor vapor-deposition methods to machining and plating processes on electrically isolating substrates, enabling complex three-dimensional electrode geometries including curved surfaces and non-planar features while avoiding hazardous chemicals
Solution Approach 2:
The patent specifically enables curved electrode surfaces and non-planar geometries by using machining processes that can create complex shapes on substrates before plating, allowing electrode structures with curved pathways and three-dimensional features that cannot be achieved with standard semiconductor fabrication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the fabrication of compact, cost-effective ion optics components with simplified assembly, capable of forming complex ion transport pathways, enhancing the feasibility of miniaturized mass spectrometers for field applications.
Implementation Method 1
plating and masking the electrode support to form an electrode body on each of the surface segments and to form surface traces connecting between the electrode bodies
Data Source
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AI summary
A method of making an ion optics component includes providing an electrically isolating substrate and machining away material of the substrate from at least one major surface thereof to form features of a first electrode sub-assembly. The formed features include a first surface for supporting integration of a first electrode body and a second surface for supporting integration of a second electrode body. Subsequent plating and masking steps result in the formation of a first electrode body on the first surface and a second electrode body on the second surface. A bridge is integrally formed in the electrically isolating material, so as to electrically isolate the first electrode body from the second electrode body.