Ion Plating Carrier Rod Voltage Stability via Equipotential Contact

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Solution Overview

Problem

In ion plating devices, applying a bias voltage to the carrier frame during the coating process leads to irregular changes in the bias voltage, potentially resulting in a coating film of undesired quality.

Innovation Solution

A deposition apparatus with a conveyed carrier that includes rods supporting the cutting tool, where protrusion members on the carrier's outer surface and an interference member on the deposition chamber wall maintain the same potential, preventing voltage drops due to spark contact and ensuring stable bias voltage application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the bias voltage is applied to the carrier frame during coating, then the coating process can be performed, but the bias voltage becomes irregularly changed during carrier frame movement

Engineering Contradiction:
Improvebias voltage stabilityVSAvoidcarrier frame movement
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent divides the carrier into separate components: a non-conductive carrier frame and conductive rods that support the workpiece. The bias voltage is applied to the rods rather than the entire carrier frame, segmenting the electrical pathway to prevent voltage instability during movement.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The interference member and protrusion member are designed to maintain the same electrical potential to prevent spark generation. When they come into contact, no potential difference exists, eliminating the harmful spark effect that would cause voltage changes.

Inventive Principle:
Principle #12Equipotentiality

2Ease of operation

If the interference member and protrusion member come into contact to rotate the rod, then the workpiece rotation is achieved, but voltage decreases due to spark generation

Engineering Contradiction:
Improveworkpiece rotationVSAvoidvoltage stability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The interference member is electrically connected to the bias power source, ensuring it maintains the same potential as the protrusion member on the rod. This equipotential design allows contact between the interference member and protrusion member without generating sparks, enabling workpiece rotation while maintaining voltage stability.

Inventive Principle:
Principle #12Equipotentiality

3Manufacturing precision

If the carrier is conveyed through the deposition region, then coating film formation is enabled, but the bias voltage fluctuates during conveyance

Engineering Contradiction:
Improvecoating film qualityVSAvoidbias voltage consistency
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent segments the electrical connection by applying bias voltage only to the conductive rods holding the workpiece, rather than the entire moving carrier frame. This segmentation isolates the voltage application to stationary or controlled elements, preventing voltage fluctuations during carrier conveyance through the deposition region.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for the stable application of bias voltage, resulting in the formation of high-quality coating films on cutting tools.

Implementation Method 1

a heating region which is disposed to be adjacent to the deposition region in the carrier conveying direction and heats the object to be coated before the object to be coated enters the deposition region

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

a bias power source which applies a bias voltage to the object to be coated via the conveyed carrier

Methodology Applied
Scientific EffectElectric Field: Electric Field

Implementation Method 3

since the interference member and the protrusion member of the conveyed carrier can be maintained at the same potential, it is possible to prevent a voltage of the conveyed carrier from decreasing due to spark generated when the interference member and the protrusion member come into contact with each other

Methodology Applied
Scientific EffectElectrostatic Induction: Electrostatic Induction

Implementation Method 4

a deposition chamber which includes a deposition region for forming a coating film on an object to be coated

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Data Source

PatentEP3252185B1Film forming device and method for manufacturing coated cutting tool
Publication Date: 2020.11.04 MITSUBISHI MATERIALS CORP
  • EP3252185B1 patent drawingFigure 1
  • EP3252185B1 patent drawingFigure 2
  • EP3252185B1 patent drawingFigure 3

AI summary

This deposition apparatus includes a deposition chamber which includes a deposition region for forming a coating film on an object to be coated, a conveying device which conveys a conveyed carrier supporting the object to be coated, and a bias power source which applies a bias voltage to the object to be coated via the conveyed carrier, in which a plurality of rods which support the object to be coated and rotate around axes are disposed in the conveyed carrier along a carrier conveying direction in an upright posture, a protrusion member protruding to the outside in a radial direction is provided on an outer peripheral surface of the rod, an interference member which catches the protrusion member of the conveyed carrier moving in the deposition chamber and rotates the rod around the axis is provided on a wall surface of the deposition chamber via an insulation member, and the interference member and the bias power source are electrically connected to each other.