Ion Source Repeller Ceramic Target Gap Design
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Solution Overview
Problem
Ion implantation systems face inefficiencies and reduced lifetime due to limitations in the design of ion sources, particularly in the repeller components, which affect the etching and sputtering processes of target materials.
Innovation Solution
An improved ion source design featuring a ceramic target member and repeller shaft separated by a gap, with the target member encircling the repeller shaft and electrically isolated, allowing for indirect heating and enhanced gas conductance, which increases the efficiency and longevity of the ion source by improving chemical etching and sputtering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the repeller and target material are in direct contact, then mechanical support is provided, but thermal conduction causes overheating and reduced lifetime
Solution Approach 1:
The patent introduces a ceramic spacer as an intermediary component between the repeller and target material. This spacer provides mechanical support while having low thermal conduction properties, thus preventing heat transfer from the repeller to the target member and solving the overheating issue that reduced ion source lifetime.
Solution Approach 2:
The patent replaces direct mechanical contact (which causes thermal conduction) with an indirect support structure using ceramic spacers. This substitution maintains the mechanical support function while eliminating the harmful thermal conduction path, thereby extending the ion source operational lifetime.
2Productivity
If gas conductance between repeller and target material is limited, then thermal conduction is reduced, but chemical etching efficiency decreases
Solution Approach 1:
The patent segments the space between repeller and target material into multiple regions using ceramic spacers positioned at different locations. This segmentation creates controlled gas flow paths that enhance chemical etching efficiency while the ceramic material itself blocks thermal conduction, thus resolving the contradiction between etching productivity and energy loss.
3Stability of the object's composition
If the target member is electrically connected to the repeller, then structural stability is maintained, but electrical discharge and arcing occur
Solution Approach 1:
The patent uses ceramic spacers as intermediary components that provide mechanical support while being electrically insulating. This prevents direct electrical contact between the repeller and target member, eliminating harmful electrical discharge and arcing while maintaining structural stability through the mechanical support function of the spacers.
4Productivity
If beam current utilization is increased, then productivity improves, but repeller-target interaction optimization is compromised
Solution Approach 1:
The patent optimizes parameters including the gap distance between repeller and target member, the positioning and dimensions of ceramic spacers, and gas flow characteristics. These parameter changes enable improved beam current utilization while maintaining reliable repeller-target interaction through controlled chemical etching and sputtering processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances beam current utilization, increases the ion source's productivity and lifetime, and reduces downtime by optimizing the repeller-target interaction, leading to more efficient chemical etching and sputtering of target materials.
Implementation Method 1
The repeller shaft is not in electrical or mechanical contact with the target member, and is configured to indirectly heat the target member
Implementation Method 2
ion source gases such as fluorine or other volatile species can enhance chemical etching of the target material
Implementation Method 3
A repeller is positioned opposite the cathode, where a target source material can be provided near the repeller, wherein ion source gases such as fluorine or other volatile species can enhance chemical etching of the target material
Implementation Method 4
The target member, for example, is comprised of a ceramic material and takes the form of a cylinder generally encircling the repeller shaft, wherein the gap mechanically and electrically separates the cylinder from the repeller shaft
Data Source
AI summary
An ion source has an arc chamber having one or more arc chamber walls defining and interior region of the arc chamber. A cathode electrode is disposed along an axis. A repeller has a repeller shaft and a ceramic target member separated by a gap. The repeller shaft is not in electrical or mechanical contact with the target member, and the repeller shaft is configured to indirectly heat the target member. The target member, can be a cylinder encircling the repeller shaft, where the gap separates the cylinder from the repeller shaft. A top cap can enclose the cylinder can be separated from a top repeller surface of the repeller shaft by the gap. A target hole can be in the top cap. The target member can be supported by a bottom liner of the arc chamber or a support member mechanically and electrically coupled to the repeller shaft.