Ion Trap Electrode Layout to Prevent PCB Dielectric Heating
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Solution Overview
Problem
Existing electrode arrangements for ion guides and collision cells suffer from heating issues due to dielectric loss in PCBs, leading to contamination and charge reduction in mass spectrometry, particularly when high RF voltages are applied.
Innovation Solution
The electrode arrangement features RF electrodes mechanically coupled to a dielectric material using spaced separators, creating a gap to prevent RF field penetration and using a DC electrode to shield the dielectric material, minimizing heat generation and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If RF electrodes are directly mounted on dielectric PCB material, then manufacturing is simplified and structural support is provided, but RF field penetration causes dielectric heating and contamination
Solution Approach 1:
The patent introduces DC electrodes as intermediary elements positioned between the RF electrodes and the dielectric PCB material. These DC electrodes serve as a shield that blocks RF field penetration into the dielectric material, preventing dielectric heating while maintaining the simplified PCB mounting structure. The DC electrodes are connected to ground potential, creating a protective barrier that eliminates the harmful thermal effects without compromising manufacturing ease.
Solution Approach 2:
The patent segments the electrode structure by separating RF and DC functions into distinct electrode elements. The RF electrodes are divided into multiple segments with gaps between them, and DC electrodes are positioned in these gaps and on the PCB surface. This segmentation allows the DC electrodes to intercept and shield the RF fields before they penetrate the dielectric material, solving the heating problem while preserving the integrated PCB design.
2Power
If high RF voltages are applied for collision cell operation, then ion confinement and reaction efficiency are improved, but dielectric heating and contamination increase
Solution Approach 1:
The DC electrodes act as a protective intermediary that shields the dielectric PCB material from high RF voltage fields. By positioning ground-connected DC electrodes between the high-power RF electrodes and the dielectric material, the patent prevents RF field penetration even under high power conditions. This eliminates dielectric heating and prevents outgassing and contamination that would otherwise occur during high-voltage collision cell operation.
Solution Approach 2:
The patent applies preliminary anti-action by pre-positioning DC shielding electrodes before the RF fields can penetrate the dielectric material. These DC electrodes are connected to ground potential and strategically placed to intercept RF field lines before they reach the PCB. This preemptive shielding approach prevents dielectric heating and contamination from occurring in the first place, allowing high RF voltages to be applied without harmful effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces heat generation and contamination, stabilizing ion currents and maintaining accurate mass spectra even under high RF voltage conditions.
Implementation Method 1
at least one DC electrode is located between the dielectric material and the RF electrode. The DC electrode is arranged to shield the dielectric material from the RF field generated by the RF electrode.
Implementation Method 2
the RF field penetrating the material of the PCB causes energy to be dissipated as the molecules of the dielectric (PCB) material attempt to line up with the continuously changing RF field. This dielectric loss is described by the dissipation factor, Df
Data Source
AI summary
The present invention provides an electrode arrangement 10, 10′ for an ion trap, ion filter, an ion guide, a reaction cell or an ion analyser. The electrode arrangement 10, 10′ comprises an RF electrode 12a, 12b, 12a′, 12b′ mechanically coupled to a dielectric material 11. The RF electrode 12a, 12b, 12a′, 12b′ is mechanically coupled to the dielectric material 11 by a plurality of separators 13 that are spaced apart and configured to define a gap between the RF electrode 12a, 12b, 12a′, 12b′ and the dielectric material 11. Each of the plurality of separators 13 comprises a projecting portion 13b and the dielectric material 11 comprises corresponding receiving portions 11a such that on coupling of the RF electrode 12a, 12b, 12a′, 12b′ to the dielectric material 11, the projecting portion 13b of each separator 13 is received within the corresponding receiving portion 11a of the dielectric material 11. The present invention also relates to an ion trap comprises the electrode arrangement 10, 10′ and a method of manufacturing the electrode arrangement 10, 10′.