Ion Trap Substrate Openings for Scalable Electrode Connections
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Solution Overview
Problem
Existing ion trap devices face challenges in improving electrical access to electrodes and scaling to larger sizes while maintaining efficient ion trapping and control.
Innovation Solution
The introduction of a substrate with openings for electrical coupling elements that allow direct electrical connection between electrodes and contacts on a carrier, using in-chip wirebonding to facilitate scaling and improve electrical routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If Through Silicon Vias (TSVs) are used for electrical connection between electrodes and printed circuit board, then electrical connection is provided, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts the electrical connection function from the substrate interior (TSVs) and moves it to the substrate surface (opening). The opening in the substrate allows electrical coupling elements to be positioned externally, simplifying the internal substrate structure while maintaining electrical connectivity between electrodes and the printed circuit board.
Solution Approach 2:
The patent transitions from three-dimensional internal via connections (TSVs extending through the substrate thickness) to a two-dimensional surface-level connection approach. The opening exposes the electrical coupling elements at the substrate surface, changing the connection geometry from vertical/embedded to horizontal/surface-mounted, thereby simplifying manufacturing and reducing device complexity.
2Quantity of substance
If ion trap devices are scaled to larger sizes to increase the number of trapped ions, then ion trapping capacity increases, but electrical routing and access become more difficult
Solution Approach 1:
The patent segments the electrical connection system into distinct functional elements: electrodes on the substrate, electrical coupling elements in the opening, and contacts on the printed circuit board. This segmentation allows each component to be optimized independently and facilitates scaling, as the modular connection approach can accommodate larger device sizes without proportionally increasing routing complexity.
Solution Approach 2:
The electrical coupling elements serve as intermediaries between the electrodes and the printed circuit board contacts. This intermediary structure simplifies electrical routing in scaled devices by providing dedicated connection pathways that reduce the complexity of distributing electrical signals across larger device areas with more electrodes.
3Quantity of substance
If more electrodes are added to trap more ions, then ion trapping capacity increases, but electrical routing complexity increases
Solution Approach 1:
The opening structure serves multiple functions: it provides mechanical support for electrical coupling elements, establishes electrical connections between electrodes and the printed circuit board, and simplifies the routing architecture. This multi-functional design allows the same structural feature to handle multiple electrical connections, reducing overall routing complexity even as the number of electrodes increases.
Data Source
AI summary
A device for controlling trapped ions includes a carrier including a mounting surface. The device further includes a substrate including a top surface, a bottom surface, and at least one opening extending through the substrate from the top surface to the bottom surface. The bottom surface of the substrate is arranged on the mounting surface of the carrier. The device further includes a structured electrode layer arranged on the top surface of the substrate. The structured electrode layer forms a plurality of electrodes of an ion trap configured to trap ions in a zone above the structured electrode layer. The device further includes a plurality of electrical coupling elements extending through the at least one opening of the substrate. The electrical coupling elements electrically couple the electrodes of the ion trap with a plurality of first electrical contacts arranged on the mounting surface of the carrier.