Ionic Air Flow Generator, With Emitter And Collector Stripes
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Solution Overview
Problem
Existing ionic air flow generators face limitations in miniaturization due to the use of suspended wires and perforated plates, which introduce weak points and size constraints, making it difficult to maintain consistent emitter-collector spacing and planarity.
Innovation Solution
The use of conductors joined to a dielectric substrate with an air gap between the emitter and collector, where the substrate is etched or scored to create voids for air flow, allowing for smaller device sizes and improved construction techniques such as metal deposition and lithography processes to form sharp or rounded edges for charge concentration and field reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If suspended wires are used as emitters and perforated plates as collectors, then the device can be constructed with traditional components, but the device size cannot be reduced further and weak points are introduced
Solution Approach 1:
The device is divided into multiple unit cells arranged in arrays, where each cell contains segmented emitter and collector conductors. This segmentation allows the device to be scaled while maintaining structural integrity and avoiding the weak points associated with suspended wires.
Solution Approach 2:
The patent replaces the mechanical suspended wire structure with conductors joined to a dielectric substrate. This substitution eliminates the need for mechanical suspension and tensioning, removing the associated weak points while enabling miniaturization through standard fabrication processes.
2Ease of manufacture
If wires are attached to substrates or frames, then the emitter and collector can be supported, but the construction becomes difficult and the device size increases
Solution Approach 1:
The emitter and collector conductors are merged with the dielectric substrate through direct joining processes such as metal deposition. This integration eliminates separate attachment steps and reduces the need for additional supporting structures, simplifying construction while minimizing device size.
Solution Approach 2:
The patent employs changes in material properties and fabrication parameters, using thin-film deposition techniques to join conductors to the substrate. This approach enables precise control of layer thickness and adhesion, making construction easier while allowing for miniaturized device dimensions.
3Manufacturing precision
If proper wire tension is maintained, then consistent emitter-collector spacing can be achieved, but the construction remains difficult and spacing consistency is hard to maintain
Solution Approach 1:
The patent replaces mechanical tensioning systems with a rigid dielectric substrate structure that inherently maintains consistent spacing between emitter and collector conductors. The substrate acts as a precise spacer, eliminating the need for complex tensioning mechanisms and achieving spacing consistency through fabrication precision rather than mechanical adjustment.
4Stability of the object's composition
If the collector is constructed with pins or perforated plate, then air flow can be collected, but warpage or imperfections lead to non-planar geometry
Solution Approach 1:
The collector conductor is merged with the dielectric substrate, forming an integrated structure that prevents warpage. The substrate provides a rigid, planar support that maintains geometric stability, while the conductor pattern is formed directly on the substrate surface through deposition processes, ensuring consistent planarity throughout the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the construction of smaller ionic air flow generators with higher flow rates and active cooling capabilities, achieving flow rates of 2, 3, or 4 liters per minute per cm2 of flow area, and allows for lower operating voltages, while maintaining device stability and preventing unwanted arcing.
Implementation Method 1
One conductor, which is shaped to form the high-voltage emitter with sharp edges or other features to concentrate charge
Implementation Method 2
The ionized air is drawn electrostatically to the lower-voltage collector, which, through collision with neutral molecules that in turn impart their momentum, creates a flow of air through the air gap
Implementation Method 3
The dielectric substrate is not solid between the emitter and collector. It is shaped with voids that form an air gap between the emitter and the collector. Thus, when a voltage is applied to the emitter, air is ionized at the emitter.
Data Source
AI summary
Emitter wires and collector pins of current ionic air flow generator designs are replaced by conductors joined to a dielectric substrate, such as metal deposited on the dielectric substrate. One conductor, which is shaped to form the emitter with sharp edges, is joined to one side of the dielectric substrate. Another conductor, which is shaped to form the collector with rounded edges, is joined to the opposite side of the dielectric substrate. The dielectric substrate is not solid. It is shaped with voids that form an air gap between the emitter and the collector. Thus, when a voltage is applied to the emitter, air is ionized at the emitter. The ionized air is drawn electrostatically to the lower-voltage collector, which, through collision with neutral molecules that in turn impart their momentum, creates a flow of air through the air gap.