Ionic Isolation Ring for IC Contamination Control
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Solution Overview
Problem
The penetration of a protective overcoat during the manufacturing of integrated circuits (ICs) allows contaminants to diffuse into the active areas, leading to contamination issues, which existing methods have not adequately addressed.
Innovation Solution
A sealing ring system comprising multiple electrically conductive layers and circuit traces is formed along the periphery of the IC, with strategically aligned openings to create a cavity region that extends through the protective overcoat, effectively isolating the IC and providing a long migration path for contaminants, thereby reducing diffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the protective overcoat is penetrated to etch the cavity, then the cavity can be formed for circuit trace, but contaminants can diffuse into the active areas of the IC
Solution Approach 1:
The sealing ring is divided into multiple electrically conductive layers (first set and second set) with openings at different positions, creating a segmented barrier structure that blocks contaminant diffusion paths while allowing circuit traces to pass through at specific locations
Solution Approach 2:
The sealing ring acts as an intermediary barrier structure between the cavity opening and the active IC areas, preventing direct contact between contaminants and the IC while still allowing the cavity to be formed and accessed
2Object-affected harmful factors
If a sealing ring is formed to block contaminant diffusion, then contamination is reduced, but electrical connectivity between the IC and external devices must be maintained
Solution Approach 1:
The sealing ring is segmented into multiple layers with strategically positioned openings, allowing electrical signals to pass through at discrete locations while maintaining continuous barrier coverage in other areas to block contaminant diffusion
Solution Approach 2:
The sealing ring has different properties at different locations: it is impermeable to contaminants in most areas but contains localized openings that permit electrical connectivity where needed, achieving both protection and functionality
Data Source
AI summary
There has been very little (if any) attention to address contamination diffusion within an integrated circuit (IC) because there are very few applications where a protective overcoat will be penetrated as part of the manufacturing process. Here, a sealing ring is provided that address this problem. Preferably, the sealing ring uses the combination of electrically conductive barrier rings and the tortuous migration path to allow an electronic device (i.e., thermopile), where a protective overcoat is penetrated during manufacture, to communicate with external devices while being isolated to prevent contamination.