Ionic Polymer Binder for Sinter-Free Photoelectric Conversion Layers
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Solution Overview
Problem
Dye-sensitized solar cells face challenges with low photoelectric conversion efficiency due to poor adhesion of metal oxide nanoparticles to substrates and the need for high-temperature sintering, which limits substrate materials to inorganic ones and complicates the production process.
Innovation Solution
A composition combining nano-sized semiconductor particles, such as titanium oxide, with a strongly acidic ion exchange resin as an ionic polymer, eliminating the need for sintering and enhancing adhesion to substrates, allowing for flexible plastic substrates and simplified production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal oxide nanoparticles are applied on a substrate without sintering, then the production process is simplified, but the adhesion of nanoparticles to substrate deteriorates
Solution Approach 1:
The patent introduces a binder as an intermediary substance between the metal oxide nanoparticles and the substrate. This binder mediates the adhesion process, allowing nanoparticles to adhere strongly to the substrate without requiring high-temperature sintering, thus simplifying the production process while maintaining strong adhesion.
Solution Approach 2:
The patent creates a composite structure consisting of metal oxide nanoparticles, binder, and substrate. This composite material approach allows the combination of materials with complementary properties: the metal oxide nanoparticles provide photoelectric conversion function, the binder provides adhesion, and the substrate provides mechanical support, achieving both simplified manufacturing and strong adhesion.
2Strength
If high-temperature sintering is applied to melt-bond metal oxide nanoparticles, then adhesion is improved, but the substrate material selection is restricted to inorganic materials
Solution Approach 1:
The binder acts as a thermal intermediary that enables adhesion at lower temperatures. By using the binder as a mediator, the system avoids the need for high-temperature sintering, allowing organic and flexible substrate materials to be used without degradation, thus expanding substrate material selection while maintaining adhesion.
Solution Approach 2:
The patent changes the temperature parameter from high-temperature sintering to low-temperature processing enabled by the binder. This parameter change allows the use of temperature-sensitive materials such as flexible plastics and organic substrates, significantly expanding the range of usable substrate materials while maintaining adequate adhesion.
3Strength
If high-temperature sintering is applied to melt-bond metal oxide nanoparticles, then adhesion is improved, but the production process complexity increases
Solution Approach 1:
The binder serves as a chemical intermediary that enables adhesion through chemical bonding or strong physical interaction at low temperatures. This eliminates the need for complex high-temperature sintering equipment and process control, simplifying the production process while achieving strong adhesion through the binder-mediated bonding mechanism.
4Ease of manufacture
If metal oxide nanoparticles are applied without binder, then the production process is simplified, but the electrical conductivity between particles deteriorates
Solution Approach 1:
The patent optimizes the binder concentration and composition to achieve a balance where the binder provides sufficient electrical conductivity pathways between particles without requiring high concentrations that would complicate the formulation. This parameter optimization maintains good electrical conductivity while keeping the production process simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high photoelectric conversion efficiency and adhesion without sintering, enabling the use of plastic substrates and simplifying the production process while maintaining excellent photoelectric conversion characteristics.
Implementation Method 1
the photoelectric conversion layer has excellent adhesion to a substrate
Implementation Method 2
the photoelectric conversion occurs on an interface between a metal-oxide-semiconductor and a sensitizing dye
Data Source
AI summary
A composition that can form a photoelectric conversion layer having an excellent adhesion to a substrate is provided without a sintering step. The composition comprises at least a semiconductor (e.g., a titanium oxide particle) and an ionic polymer (e.g., a fluorine-series resin having a sulfo group), and the ratio of the ionic polymer relative to 1 part by weight of the semiconductor is 0.1 to 30 parts by weight. The composition may further contain a dye (a sensitizing dye). The photoelectrically convertible layer can be formed by coating a conductive substrate with the composition without sintering the semiconductor.