Ionization Support Structure for Thin Substrate Handling
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Solution Overview
Problem
The existing sample support bodies for ionization require thinner substrates to enhance capillary action, but this makes them more susceptible to damage, complicating handling and increasing the risk of scattering during ionization processes.
Innovation Solution
A support unit with a first support body featuring an ionization substrate and a conductive layer on its surface, and a second support body with an adhesive layer that includes separate conductive and non-overlapping regions, allowing for secure adhesion and electrical connection to facilitate ionization while minimizing substrate damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is thinned to promote capillary action, then the movement of sample from second surface to first surface is improved, but the substrate becomes more susceptible to damage and handling becomes more difficult
Solution Approach 1:
The substrate is divided into two functional regions: a first region with through-holes for capillary action and ionization, and a second region without through-holes for structural support and voltage application. This segmentation allows the first region to be thin for efficient capillary action while the second region provides mechanical strength and handles damage resistance.
Solution Approach 2:
Different regions of the substrate have different properties: the first region has through-holes and is optimized for capillary action with thinner thickness, while the second region is solid, conductive, and optimized for structural support and electrical connection. This local differentiation resolves the contradiction between thinness for capillary action and thickness for durability.
2Productivity
If the substrate is thinned to enhance ionization efficiency, then the ionization process is improved, but the complexity of handling and the risk of substrate scattering increase
Solution Approach 1:
The substrate is segmented into a thin first region for ionization and a thicker second region for handling. The second region serves as a handle that can be gripped without affecting the thin first region, making handling easier while maintaining ionization efficiency.
Solution Approach 2:
The second region acts as an intermediary between the operator and the thin first region. It provides a mechanical interface for handling and a electrical interface for voltage application, protecting the thin ionization region from direct contact and potential damage during handling operations.
3Productivity
If a conductive layer is provided on the first surface to enable voltage application, then ionization is improved, but the through-holes may be blocked
Solution Approach 1:
The conductive layer is applied locally only to the second region of the substrate, not the first region with through-holes. This localized application ensures that the conductive layer enables voltage application for ionization without blocking the through-holes in the first region, resolving the contradiction between conductivity and hole openness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables reliable adhesion and electrical connection, reducing the risk of substrate damage during ionization and improving handling by allowing for thinner substrates without compromising stability, thus enhancing the ionization process.
Implementation Method 1
The measurement region adheres to the exposed part of the first portion
Implementation Method 2
The second portion of the adhesive layer has conductivity and electrically connects the second region and the conductive layer of the first support body
Implementation Method 3
a component of the sample moves from the second surface side of the substrate toward the first surface side via the through-holes due to capillary action
Data Source
AI summary
The support unit includes a first support body and a second support body. The first support body includes an ionization substrate. The second support body is disposed to face the first support body. The second support body includes a support substrate and an adhesive layer. A placement surface of the support substrate has a first region and a second region. The first region overlaps the measurement region when viewed in a Z-axis direction. The second region has conductivity and includes a region configured not to overlap the first support body when viewed in the Z-axis direction. The adhesive layer has a first portion and a second portion. The first portion is provided in the first region. The second portion has conductivity and electrically connects the second region and the conductive layer of the first support body.