IoT Connectivity Module Standard Peripheral Interface

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Solution Overview

Problem

Existing connectivity solutions for IoT devices are cumbersome and error-prone, requiring significant resources and lacking scalability, as they often necessitate custom implementations for each device, failing to meet the demand for modular and cost-effective connectivity across heterogeneous products.

Innovation Solution

A connectivity module architecture that separates connectivity and processing using a standard peripheral interface, such as I²C, SPI, or UART, allowing IoT devices to connect to a wireless network platform and expose a command protocol for device-to-device communication, simplifying the connection process and enabling communication with both IoT devices and cloud services.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If custom connectivity solutions are implemented for each IoT device, then device-specific communication requirements are met, but development resources increase and scalability decreases

Engineering Contradiction:
Improvedevice-specific communication capabilityVSAvoiddevelopment resources
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements a universal connectivity module that can be integrated into multiple types of IoT devices through a standardized host interface. The module contains a wireless network platform and D2D communication framework that can serve different device types (IoT devices, cloud services, peer devices) through the same interface, eliminating the need for custom connectivity solutions for each device type.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent segments the connectivity functionality into a separate modular component (connectivity module with wireless network platform) that interfaces with the host device through a standardized peripheral interface. This separation allows the connectivity logic to be independent from the host device implementation, reducing development complexity while maintaining adaptability.

Inventive Principle:
Principle #1Segmentation

2Ease of operation

If existing connectivity frameworks are implemented, then communication capability is added to devices, but the implementation process becomes tedious and error-prone

Engineering Contradiction:
Improveconnectivity implementationVSAvoidimplementation accuracy
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The connectivity module implements self-service through automatic service discovery and connection establishment mechanisms. The D2D communication framework automatically discovers available services and establishes connections without requiring manual configuration, reducing both the tediousness and error-prone nature of implementation while improving reliability through automated validation.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent implements preliminary action by pre-configuring the connectivity module with a complete D2D communication framework and service registry before deployment. The module comes pre-loaded with communication protocols and connection logic, eliminating the need for error-prone on-site configuration and ensuring reliable implementation across all devices.

Inventive Principle:
Principle #10Preliminary action

3Productivity

If modular connectivity solutions are adopted, then scalability and cost-effectiveness improve, but compatibility with existing MCU/processing designs must be maintained

Engineering Contradiction:
ImprovescalabilityVSAvoidcompatibility with existing designs
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The connectivity module is designed with a universal host interface that can communicate with various types of processors (MCU, microprocessor, DSP) through standard peripheral interfaces. This universal interface design allows the same modular connectivity solution to be scaled across different device platforms while maintaining compatibility with existing processor designs.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The standardized host interface acts as an intermediary between the connectivity module and diverse processor architectures. This intermediary layer abstracts the differences between various MCU/processor designs, allowing the modular connectivity solution to scale across platforms without requiring platform-specific adaptations, thus maintaining both scalability and compatibility.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP3219118B1Connectivity module for internet of things (IOT) devices
Publication Date: 2019.08.07 QUALCOMM INC
  • EP3219118B1 patent drawingFigure 1A
  • EP3219118B1 patent drawingFigure 1B
  • EP3219118B1 patent drawingFigure 1C

AI summary

The disclosure relates to an Internet of Things (IoT) connectivity module that can add connectivity to an otherwise non-connected host and simplify procedures to connect, configure, and enable device-to-device (D2D) communication between the host and various heterogeneous IoT devices. For example, according to various aspects, the connectivity module may comprise a connectivity chip configured to implement a wireless network platform (e.g., a radio-frequency front end and one or more wireless radios), one or more standard peripheral interfaces configured to interconnect the connectivity module to a host having at least one processor, and a D2D application configured to implement a proximal D2D communication framework and expose a command protocol associated with the proximal D2D communication framework via the standard peripheral interfaces. Furthermore, according to various aspects, the connectivity module may comprise a dedicated interrupt line that may be asserted to notify the host when data becomes available to consume.