IP Bonding via Modified GRE Aggregation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current bonding techniques for increasing data rates in communication systems are costly and require new hardware or complete upgrades, making it impractical for Internet service providers to deploy new technologies within their existing network architecture.

Innovation Solution

Implementing an Internet Protocol (IP) bonding scheme using modified Generic Routing Encapsulation (GRE) techniques to aggregate multiple access paths into a logical unit, allowing for bonding at a higher layer without the need for new hardware, enabling the combination of different technologies like DSL and DOCSIS connections within existing network infrastructure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If bonding techniques are implemented to increase data rates, then data capacity is improved, but hardware requirements and deployment costs increase

Engineering Contradiction:
Improvedata rateVSAvoidhardware requirements
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent moves bonding operations from the physical layer to the network layer (IP layer), changing the dimensional level at which bonding is performed. This allows multiple physical paths to be aggregated logically without requiring physical layer hardware changes, resolving the contradiction between increased data capacity and hardware complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces an IP bonding mechanism as an intermediary layer between existing physical connections and the network core. This intermediary enables capacity aggregation without modifying the underlying physical infrastructure, allowing data rate improvement without proportional hardware complexity increase

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If new technologies are deployed to increase data rates, then capacity is improved, but deployment costs increase

Engineering Contradiction:
Improvedata capacityVSAvoiddeployment cost
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The IP bonding mechanism is designed to work with multiple existing access technologies (DSL, cable, fiber, wireless) simultaneously, making it universally applicable across different network infrastructures. This allows ISPs to increase capacity using existing diverse technologies without requiring expensive uniform technology deployment

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent creates a logical copy of bonding capabilities at the IP layer that mirrors physical layer bonding functionality. This software-based approach replicates the effects of physical layer bonding without requiring expensive new hardware deployments, enabling capacity increase through intelligent software rather than expensive hardware copying

Inventive Principle:
Principle #26Copying

3Speed

If physical layer services are upgraded to provide higher capacity, then data rate is improved, but infrastructure investment increases

Engineering Contradiction:
Improvedata rateVSAvoidinfrastructure investment
Core Design Contradiction:
SpeedVSQuantity of substance

Solution Approach 1:

The patent shifts the bonding function from physical layer infrastructure to network layer software, changing the dimension where capacity multiplication occurs. This allows multiple existing physical paths to be combined logically without investing in new physical infrastructure, achieving higher effective data rates without proportional infrastructure investment

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS7724742B2Communication bonding systems and methods
Publication Date: 2010.05.25 CISCO TECHNOLOGY INC
  • US7724742B2 patent drawing
  • US7724742B2 patent drawing
  • US7724742B2 patent drawing

AI summary

Systems and methods are disclosed herein to provide IP bonding. For example, in accordance with an embodiment of the present invention, an IP bonding scheme is disclosed that modifies Generic Routing Encapsulation techniques such that information may be divided and carried through multiple paths (e.g., to improve capacity).