IPD Antenna Array Module with Air Shielding for 5G
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Solution Overview
Problem
The high cost and capacitive coupling issues in manufacturing antenna arrays for RF communication devices, particularly in printed circuit boards (PCBs) and integrated passive devices (IPDs), limit performance and increase manufacturing costs, especially in millimeter wave frequency ranges.
Innovation Solution
The antenna array module comprises two or more antenna elements formed as integrated passive devices (IPDs) with a multi-layer PCB, where each IPD has a silicon or glass substrate with a high resistivity metal layer, and capacitive coupling is minimized by using air and a metal shield to reduce unwanted interactions between IPDs, allowing for improved beamforming and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If antenna arrays are manufactured using traditional PCB methods with multiple laminate layers, then manufacturing cost increases, but capacitive coupling between antenna elements also increases
Solution Approach 1:
The patent divides the antenna array into separate IPD modules, each containing individual antenna elements on separate silicon substrates. This segmentation allows each antenna element to be independently packaged and connected via conductive contacts, reducing the capacitive coupling that occurs when elements are closely spaced on the same PCB substrate. The segmentation principle resolves the contradiction by enabling cost-effective manufacturing through modular IPD packages while minimizing harmful capacitive coupling between elements.
2Ease of manufacture
If antenna elements are formed as separate IPDs to reduce PCB layers and cost, then manufacturing cost decreases, but capacitive coupling between elements increases due to higher dielectric constant of silicon
Solution Approach 1:
The patent introduces air as an intermediary medium between the IPD packages containing antenna elements. By spacing the IPD modules apart and using air (with its low dielectric constant) rather than silicon substrate material between the elements, the capacitive coupling is significantly reduced. This intermediary approach allows the system to benefit from the cost advantages of IPD manufacturing while mitigating the harmful capacitive coupling effect that would otherwise result from using silicon substrates.
3Reliability
If multiple laminate layers are used in PCB to accommodate antenna elements, then antenna array performance is maintained, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the antenna elements with separate IPD packages, combining the antenna functionality with the packaging structure. Instead of requiring multiple complex PCB laminate layers to accommodate and isolate antenna elements, the elements are integrated into individual IPD modules that are then mounted on a simplified PCB substrate. This merging principle reduces the overall device complexity and manufacturing cost while maintaining antenna array performance through the preserved electrical characteristics of the elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces capacitive coupling, lowers manufacturing costs, and enhances the performance of antenna arrays by allowing for smaller, more efficient antenna elements and improved beamforming capabilities, particularly in millimeter wave frequencies for 5G applications.
Implementation Method 1
capacitive coupling is minimized by using air and a metal shield to reduce unwanted interactions between IPDs
Implementation Method 2
each IPD has a silicon or glass substrate with a high resistivity metal layer
Data Source
AI summary
An antenna array module includes two or more antenna elements arranged in an array, each of the two or more antenna elements formed as a respective integrated passive device (IPD), and a multi-layer printed circuit board (PCB) including one or more metal layers forming one or more feed lines of the antenna elements. The antenna array module may include a radio frequency (RF) front end integrated circuit disposed on an opposite side of the multi-layer PCB from the two or more antenna elements. One or more signal output pins of the RF front end integrated circuit may be connected to the one or more feed lines. The antenna array module may include conductive contacts external to the multi-layer PCB for routing input signals through the multi-layer PCB to one or more signal input pins of the RF front end integrated circuit.