IPD Balun Circuit with Interlaced Coils for Substrate Area Reduction
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Solution Overview
Problem
The existing Balun circuits manufactured by the low temperature co-fired ceramic (LTCC) process require a larger substrate area due to the need for surface-mount technology connections, occupying excessive space in communication devices.
Innovation Solution
A Balun circuit manufactured using the integrate passive device (IPD) process, where the Balun circuit is directly disposed on the RF transceiver chip, reducing the required substrate area and utilizing a coplanar spiral structure with interlaced coils and bridges for efficient signal transformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the Balun circuit is manufactured by LTCC process, then the circuit can be electrically connected to substrate through SMT, but the substrate requires larger area and occupies more space
Solution Approach 1:
The patent merges the Balun circuit with the RF transceiver chip by directly disposing the Balun circuit on the chip substrate, eliminating the need for separate LTCC manufacturing and SMT connection processes. This integration reduces the overall substrate area required while maintaining electrical connection functionality.
Solution Approach 2:
The substrate is designed to serve multiple functions: it acts as both the mounting platform for the RF transceiver chip and as the electrical connection medium for the Balun circuit. By making the substrate multi-functional, the patent eliminates the need for separate connection structures and reduces overall space requirements.
2Area of stationary object
If the Balun circuit is directly disposed on the RF transceiver chip, then the substrate area is reduced, but the manufacturing process must be changed from LTCC to IPD
Solution Approach 1:
The patent changes the manufacturing process parameter from LTCC (low temperature co-fired ceramic) to IPD (integrated passive device). This parameter change enables direct integration of the Balun circuit on the chip substrate, reducing substrate area while maintaining manufacturing feasibility through established semiconductor fabrication processes.
Data Source
AI summary
A Balun circuit manufactured by integrate passive device (IPD) process. The Balun circuit includes a substrate, a first coplanar spiral structure, and a second coplanar spiral structure. One end of the innermost first left coil of the first coplanar spiral structure is electrically connected to the innermost first right coil through a first bridge. Two ends of the first coplanar spiral structure are electrically connected to the outermost first left coil and the outermost right coil respectively. One end of the innermost second left coil of the second coplanar spiral structure is electrically connected to the innermost second right coil through a second bridge. Two ends of the second coplanar spiral structure are electrically connected to the outermost second left coil and the outermost second right coil respectively. The first left coils and the second left coils are interlaced. The first right coils and the second right coils are interlaced.