Semiconductor Package IPD Crack Detection With Daisy Chains
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Solution Overview
Problem
In integrated circuit packaging, the incorporation of multiple device dies and independent passive devices (IPDs) leads to issues such as IPD cracking during manufacturing, which cannot be monitored in real time, resulting in the loss of high-cost components.
Innovation Solution
A semiconductor package structure and method that includes detecting devices with detecting bumps and daisy chains to monitor and identify defective IPDs during manufacturing, allowing for economic repair through a rework process instead of discarding defective packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple device dies and IPDs are incorporated in the same package to achieve more functions, then the functionality and integration level are improved, but the complexity of manufacturing increases and IPD cracking issues occur during the process
Solution Approach 1:
The patent divides the integrated circuit package into distinct functional segments: device dies for active circuitry, IPDs for passive components, and dedicated testing structures. This segmentation allows each component to be optimized and tested independently, reducing manufacturing complexity while maintaining high functionality.
Solution Approach 2:
The patent implements testing structures and detection mechanisms before final packaging is completed. By performing preliminary tests on IPDs and device dies during the assembly process, defects can be identified early, preventing the need to discard entire packages and simplifying the manufacturing process.
2Adaptability or versatility
If IPDs are incorporated in the package, then the functionality is improved, but IPD cracking occurs during manufacturing which cannot be monitored in real time, resulting in loss of high-cost components
Solution Approach 1:
The patent incorporates testing structures that provide real-time feedback on IPD integrity during the packaging process. These testing structures monitor for cracking and other defects, allowing immediate detection and correction before final assembly, thus preventing loss of high-cost components.
Solution Approach 2:
The patent performs preliminary testing of IPDs during the assembly process rather than waiting until final packaging. This preliminary action allows cracks to be detected early when repair or replacement is still feasible, maintaining IPD integrity and reducing waste.
3Difficulty of detecting and measuring
If testing structures are added to monitor IPD defects, then the detection capability is improved, but the device complexity increases
Solution Approach 1:
The patent merges the testing structures with the existing package components. The testing structures are integrated into the package substrate or interposer, sharing physical space and manufacturing processes with other components. This merging approach enables defect detection without proportionally increasing overall package complexity.
Solution Approach 2:
The testing structures are designed to serve multiple functions: detecting IPD cracking, verifying electrical connectivity, and validating package integrity. This multi-functionality allows a single set of testing structures to address multiple quality concerns, reducing the need for separate complex testing systems.
Data Source
AI summary
A semiconductor package structure includes an interposer, an IPD package, a plurality of detecting bumps, and a plurality of daisy chains. The interposer includes at least a detecting pad and a plurality of bonding pads. The IPD package includes a plurality of metal bumps. The detecting bumps are disposed in the IPD package and separated from the metal bumps of the IPD package. The daisy chains are disposed in the IPD package and electrically connected to the detecting bumps.