IPD Testing via DTS Module for Thermal Mismatch Reliability
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Solution Overview
Problem
The integration of integrated passive devices (IPDs) with other circuits or die in semiconductor packages often results in low-reliability devices due to mismatched coefficients of thermal expansion, leading to structural damage and reliability issues in high-frequency applications like RF systems.
Innovation Solution
A diagnosis test solution (DTS) module is introduced to perform pass/fail determination of IPDs attached to integrated circuits on product wafers, using a probe card with RF probes and a DTS module that generates test signals and receives responses, allowing for testing of IPDs without affecting the SoC die, and optionally includes a redundant DTS module for fault tolerance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If IPDs are integrated with SoC die in semiconductor packages, then functionality is improved, but reliability deteriorates due to thermal expansion mismatch
Solution Approach 1:
The patent implements preliminary testing of IPDs using a DTS module before final package assembly. The test system applies test signals to IPDs on the wafer and measures responses to identify defective devices early, preventing unreliable IPDs from being integrated into the final semiconductor package. This preliminary action ensures only reliable IPDs are combined with SoC die, resolving the reliability issue while maintaining functionality integration.
2Adaptability or versatility
If multiple IPDs are combined in semiconductor packages, then system functionality is improved, but difficulty of detecting and measuring individual IPD performance worsens
Solution Approach 1:
The patent segments the testing process by isolating individual IPDs for measurement. The DTS module connects to specific IPDs on the wafer through probe cards, allowing independent testing of each IPD's electrical characteristics. This segmentation enables precise measurement of individual IPD performance (such as capacitance, inductance, or resistance) even when multiple IPDs are present in the package, resolving the measurement difficulty while maintaining system functionality.
Solution Approach 2:
The patent introduces a DTS module as an intermediary testing system between the IPDs and the test equipment. This intermediary module generates test signals, interfaces with IPDs through probe cards, and processes responses to determine IPD performance. The intermediary enables indirect but accurate measurement of IPD characteristics without requiring direct access to each component, solving the measurement challenge in multi-IPD configurations.
3Adaptability or versatility
If IPDs are tested after integration with SoC die, then device completeness is improved, but testing complexity and potential damage risk worsen
Solution Approach 1:
The patent performs IPD testing before final integration with SoC die by testing IPDs while they are still on the wafer. The DTS module applies test signals to IPDs through probe cards in a preliminary testing stage, identifying defective IPDs before they are assembled into complete semiconductor packages. This preliminary testing reduces overall testing complexity by eliminating the need for complex post-integration testing and prevents potential damage to already-assembled devices.
Data Source
AI summary
A semiconductor device is disclosed. The semiconductor device includes: a System on Chip (SoC) die; an integrated passive device (IPD); and a first switch, coupled between the SoC die and the IPD; wherein the IPD and the SoC die are disposed in different wafers and bonded together, and the first switch is controlled to disconnect the IPD from the SoC die when the IPD is under a test; and the first switch is controlled to connect the IPD with the SoC die when the IPD is not under the test. A test system for testing an IPD of a semiconductor device and an associated method are also disclosed.