Semiconductor Package IPD Grinding Inversion
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Solution Overview
Problem
The challenge is to create a semiconductor package with a thinner form factor while maintaining signal integrity, as consumers prefer thinner mobile devices, and existing technologies face difficulties in handling and placing thin integrated passive devices (IPDs) without damaging them and ensuring reliable electrical performance.
Innovation Solution
The solution involves integrating an IPD into an integrated fan-out (IFO) structure by placing a thicker IPD component over a chip and grinding it to a thinner form, embedding SMD components in the molding compound to relax design margins, and using a backside redistribution layer with open pads to allow molding material flow, thereby reducing the height constraints and improving electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a thinner IPD component is used to reduce package height, then the form factor is improved, but the handling and placement reliability deteriorates due to increased fragility
Solution Approach 1:
The patent inverts the conventional approach by first using a thicker, more robust IPD component that is easier to handle and place reliably, then grinding it down to the desired thin thickness after placement. This reverses the traditional sequence of making the component thin first and then attempting to place it, thereby solving the fragility issue while achieving the thin form factor goal.
Solution Approach 2:
The grinding process is performed as a preliminary action before placement to create a thicker IPD component with better mechanical strength for handling. After placement, the component is ground to the final thin thickness. This preliminary thickening action ensures reliable placement while still achieving the desired thin final form factor.
2Length of moving object
If the IPD component is made thinner to meet consumer demand, then the form factor is improved, but the risk of damage during handling increases
Solution Approach 1:
The patent applies inversion by creating a thicker IPD component first, which has lower handling damage risk, placing it reliably, and then grinding it to the thin final thickness. This reverses the conventional approach of making the component thin before placement, thereby eliminating the handling damage risk while achieving the thin form factor.
Solution Approach 2:
The thicker initial IPD component serves as a cushioning protection during the handling and placement process. The extra thickness provides mechanical robustness that protects the component from damage, and the grinding process removes this protective thickness only after the component is securely in place.
3Device complexity
If conventional placement methods are used for thin IPDs, then the process is simple, but the electrical performance reliability deteriorates
Solution Approach 1:
The patent performs the grinding action as a preliminary step before placement, creating a thicker, more robust component that is easier to handle and place with higher reliability. The additional process step of grinding after placement is offset by the elimination of complex handling precautions that would be needed for ultra-thin components, effectively maintaining process simplicity while improving electrical performance reliability.
Data Source
AI summary
According to an exemplary embodiment, a semiconductor package is provided. The semiconductor package includes: a chip having a plurality of joint pads; a component having a plurality of metal caps on one side and having a grinded surface on the other side, wherein the metal caps are in contact with the joint pads of the chip.