IPD Package Guard Structure for Clean Connector Regions

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Solution Overview

Problem

The semiconductor industry faces challenges in integrating high-density electronic components due to the need for smaller feature sizes and packages, which complicates the protection of connectors during packaging processes.

Innovation Solution

The implementation of integrated passive devices (IPDs) with a guard structure, such as a dam structure or trench, on the backside of the substrate to prevent underfill layer contamination and protect connectors during packaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If integrated passive devices (IPDs) are integrated into smaller packages to improve integration density, then the integration density increases, but the connectors become more vulnerable to contamination during packaging processes

Engineering Contradiction:

Improveintegration densityVSAvoidconnector cleanliness

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The package structure is segmented into distinct functional regions: a connector region housing the connectors and a guard structure that physically separates this region from the underfill application area. This segmentation allows the connector region to be protected from underfill contamination while maintaining the overall compact package design for high integration density

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A guard structure acts as an intermediary element between the connectors and the underfill layer. This guard structure includes a first portion extending over the connectors and a second portion extending onto the substrate, creating a protective barrier that prevents direct contact between underfill material and connectors during the packaging process

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If feature sizes are reduced to integrate more components, then integration density improves, but manufacturing complexity increases

Engineering Contradiction:

Improveintegration densityVSAvoidpackage structure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The guard structure serves multiple functions simultaneously: it acts as a physical barrier protecting connectors from underfill contamination, provides structural support in the compact package design, and defines the boundary between different functional regions. This multi-functionality reduces the need for additional separate protective components, thereby managing manufacturing complexity while achieving high integration density

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250054894A1Package structure including IPD and method of forming the same

Publication Date: 2025.02.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A device includes a first die, an interconnect structure, a RDL layer, a guard structure and an underfill layer. The interconnect structure is electrically connected to the first die. The RDL layer is disposed in a dielectric layer. The guard structure is disposed in the dielectric layer to define a connector region, wherein the guard structure and the interconnect structure are disposed on opposite sides of the die. The underfill layer surrounds the interconnect structure, the first die and the guard structure, wherein the underfill layer is kept outside of the connector region by the guard structure.