IPD Package Guard Structure for Underfill Contamination Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in integrating passive devices into smaller packages due to contamination risks during packaging processes, which can affect the reliability and yield of 3D packaging and 3DIC devices.
Innovation Solution
The implementation of a guard structure, either as a dam structure or trench configuration within the dielectric layer, prevents contamination by isolating the connector region from underfill materials, ensuring the connectors remain clean and functional.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the package size is reduced to integrate more components, then the integration density is improved, but the risk of contamination during packaging processes increases
Solution Approach 1:
The connector region is segmented from the rest of the package by introducing a guard structure (dam structure or trench) that physically divides the package into isolated regions. This segmentation prevents underfill material from reaching the connector region while allowing the overall package size to remain small for high integration density.
Solution Approach 2:
The guard structure acts as an intermediary barrier between the underfill material and the connector region. This intermediate structure prevents direct contact between the contaminant (underfill) and the sensitive component (connector), thereby maintaining reliability despite reduced package size.
2Reliability
If a guard structure is introduced to prevent contamination, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The guard structure is implemented with local quality by positioning it specifically at the connector region where contamination prevention is most critical. The structure uses localized properties (height, width, material) optimized for the specific function of blocking underfill while maintaining simplicity in other areas of the package.
3Manufacturing precision
If the connector region is isolated from underfill materials, then the manufacturing precision is improved, but the ease of manufacture decreases
Solution Approach 1:
The guard structure is formed as a preliminary action during the package fabrication process, before the underfill material is applied. By pre-establishing the protective barrier, the subsequent underfill application process becomes simpler and does not require additional complex steps to prevent contamination.
Data Source
AI summary
A package structure including IPD and method of forming the same are provided. The package structure includes a die, an encapsulant laterally encapsulating the die, a first RDL structure disposed on the encapsulant and the die, an IPD disposed on the first RDL structure and an underfill layer. The IPD includes a substrate, a first connector on a first side of the substrate and electrically connected to the first RDL structure, a guard structure on a second side of the substrate opposite to the first side and laterally surrounding a connector region, and a second connector disposed within the connector region and electrically connected to a conductive via embedded in the substrate. The underfill layer is disposed to at least fill a space between the first side of the IPD and the first RDL structure. The underfill layer is separated from the connector region by the guard structure.