IPD Retaining Structure for Inter-Layer Peeling Resistance
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Solution Overview
Problem
Integrated passive devices (IPDs) experience peeling of layers due to differences in thermal expansion coefficients between conductive and insulating materials, leading to tensile stress and chipping during the cutting process, which compromises adhesion and structural integrity.
Innovation Solution
The introduction of a retaining structure surrounding the boundary of the effective area in the electronic device, comprising multiple retaining layers and connecting structures to enhance adhesion between conductive layers, using materials such as silicon oxide, silicon nitride, silicon oxynitride, polyesters, polycarbonates, copper, titanium, aluminum, and carbon nano tubes, to stabilize the stacked structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple conductive layers and insulating layers are alternately stacked to form IPD, then the integration density and electrical performance are improved, but the difference in thermal expansion coefficients between materials causes tensile stress and inter-layer peeling
Solution Approach 1:
The retaining structure is divided into multiple retaining layers (first retaining layer, second retaining layer, third retaining layer) that are distributed at different heights within the stacked structure. Each retaining layer is positioned between specific conductive layers to provide localized reinforcement and stress distribution, preventing peeling at critical interfaces while maintaining overall structural integrity.
Solution Approach 2:
The retaining layers are strategically positioned at specific locations where stress concentration and peeling are most likely to occur. The first retaining layer is between the first and second conductive layers, the second retaining layer is between the second and third conductive layers, and the third retaining layer extends from the second to fourth conductive layers, providing targeted reinforcement at critical interfaces.
2Productivity
If the stacked structure is cut after fabrication, then individual devices are produced, but the tensile stress causes chipping and compromises structural integrity
Solution Approach 1:
The retaining structure is formed before the cutting process to preemptively strengthen the stacked structure. By establishing the retaining layers and connecting structures in advance, the structure is prepared to withstand the stresses of subsequent cutting operations, preventing chipping and maintaining integrity during device separation.
Solution Approach 2:
The retaining structure acts as a cushioning element that absorbs and distributes stress before it can cause damage during cutting. The retaining layers and connecting structures create a buffer zone that protects the conductive and insulating layers from the harmful effects of cutting-induced tensile stress.
3Stability of the object's composition
If retaining structure with multiple retaining layers is introduced to enhance adhesion, then inter-layer peeling is reduced, but the device complexity and fabrication process are increased
Solution Approach 1:
The retaining structure serves multiple functions simultaneously: it enhances inter-layer adhesion, distributes thermal stress, prevents peeling during operation, and protects the structure during cutting operations. By consolidating these functions into a single integrated structure, the patent avoids the need for separate components for each function, thereby reducing overall complexity.
Solution Approach 2:
The retaining layers are nested within the stacked structure of conductive and insulating layers, with each retaining layer positioned between specific conductive layers. This nested arrangement integrates the retaining structure into the existing architecture without requiring separate external support structures, minimizing additional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The retaining structure effectively enhances inter-layer adhesion, reducing tensile stress and peeling, thereby improving the structural integrity and reliability of the IPD.
Implementation Method 1
the retaining structure is configured to enhance adhesion between conductive layers adjacent to each other in the electronic device
Implementation Method 2
differences in thermal expansion coefficients between conductive and insulating materials, leading to tensile stress
Data Source
AI summary
An electronic device is provided. The electronic device includes electric components in an effective area; and a retaining structure substantially surrounding a boundary of the effective area. The electronic device includes a base substrate, and multiple conductive layer and multiple insulating layers alternately stacked on the base substrate. The retaining structure is configured to enhance adhesion between conductive layers adjacent to each other in the electronic device. The retaining structure includes one or more retaining layers. A respective retaining layer of the one or more retaining layers is in direct contact with at least one insulating layer of the electronic device.