IPD Package Stacking for Shorter Routing in Power Modules
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Solution Overview
Problem
The increasing complexity of integrated circuit packages, where Independent Passive Devices (IPDs) are bonded to the front side of Integrated Fan-Out (InFO) packages, leads to reduced solder ball sizes and increased current density, causing performance degradation due to competitive area usage and long lateral routing paths.
Innovation Solution
The formation of IPD packages with a flexible connection scheme, where IPD dies are encapsulated and stacked beneath power modules, reducing area competition and shortening routing paths through vertical stacking, and allowing flexible interconnection of passive devices for desired capacitance, resistance, and inductance values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If IPDs are bonded to the front side of InFO packages, then more functions are achieved, but solder ball size is reduced and current density increases
Solution Approach 1:
The patent transitions from planar bonding of IPDs on the front side to vertical stacking of IPD packages beneath power modules. This dimensional change from 2D to 3D arrangement allows IPDs to be integrated without occupying front-side area, thereby preserving solder ball size and reducing current density while maintaining package functionality.
2Adaptability or versatility
If IPDs are bonded to the front side of InFO packages, then more functions are achieved, but routing path length is increased
Solution Approach 1:
The patent implements vertical stacking of IPD packages beneath power modules, creating direct vertical interconnections. This eliminates long lateral routing paths by establishing short vertical pathways through the package stack, thereby reducing routing length while maintaining full package functionality.
3Area of stationary object
If IPDs are bonded to the front side of InFO packages, then area utilization is maximized, but solder ball current density increases
Solution Approach 1:
The patent moves IPD integration from the horizontal plane to the vertical dimension by stacking IPD packages beneath power modules. This spatial reorganization preserves the entire front-side area for power module solder balls, preventing current density increase while achieving full area utilization through vertical space exploitation.
4Productivity
If IPDs are bonded to the front side of InFO packages, then integration density is increased, but performance is degraded
Solution Approach 1:
The patent achieves high integration density by stacking IPD packages vertically beneath power modules rather than placing them laterally on the front side. This vertical integration maintains short interconnection paths and avoids performance degradation while achieving dense packaging through the Z-dimension.
Data Source
AI summary
A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package.