Integrated Passive Device Structure Reducing Substrate Size
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Solution Overview
Problem
The existing methods for integrating passive components with integrated circuit chips require a substrate of sufficient size to accommodate both, leading to increased space usage, as passive components need to be separately mounted, which is undesirable for minimizing substrate size.
Innovation Solution
The integration of passive device structures directly into the electronic component, such as through vias and dielectric layers, allows for the incorporation of capacitors, resistors, and inductors within the chip itself, eliminating the need for separate mounting and thus reducing the overall substrate size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive components are separately mounted to the substrate using surface mount technology, then the integrated circuit chip and passive component can be independently manufactured and assembled, but the substrate size must be sufficiently large to accommodate side-by-side mounting, increasing overall space usage
Solution Approach 1:
The patent merges the passive component structure with the integrated circuit chip structure by forming the passive component within the same semiconductor substrate. The passive component shares the substrate with the active circuit, eliminating the need for separate mounting and reducing overall substrate area while maintaining independent functionality of both components
Solution Approach 2:
The passive component is nested within the same substrate as the active circuit, with the passive component structure being formed inside or alongside the active circuit structures. This nesting approach allows both components to coexist in the same space, minimizing the total area required
2Stability of the object's composition
If passive components are separately mounted to the substrate, then the integrated circuit chip maintains its structural integrity, but the mounting process complexity increases and space efficiency decreases
Solution Approach 1:
By combining the passive component fabrication with the active circuit fabrication processes, the patent eliminates separate mounting operations. Both components are formed in the same substrate using integrated processing steps, reducing mounting process complexity while maintaining structural integrity through unified fabrication
3Area of stationary object
If passive components are integrated within the electronic component, then substrate size is minimized and space efficiency is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the substrate into different functional regions - active circuit regions and passive component regions - allowing simultaneous formation of both component types through a systematic multi-step process. This segmentation enables efficient space utilization while organizing the manufacturing process into manageable stages
Solution Approach 2:
The patent utilizes vertical layering and three-dimensional structuring to accommodate both active and passive components within the same planar footprint. By forming structures in multiple layers and using vertical vias and trenches, the design achieves high density integration without excessive planar complexity
Data Source
AI summary
An integrated passive device (IPD) structure includes an electronic component having an active surface and an opposite inactive surface. The IPD structure further includes a passive device structure extending through the electronic component between the active surface and the inactive surface and having a portion(s) formed on the active surface, the inactive surface, or both the active and inactive surfaces. Accordingly, the IPD structure includes the functionality of the electronic component, e.g., an integrated circuit chip, and of the passive device structure, e.g., one or more capacitors, resistors, inductors, or surface mounted components. By integrating the passive device structure with the electronic component to form the IPD structure, separate mounting of passive component(s) to the substrate is avoided this minimizing the substrate size.