Integrated Passive Devices in Substrate Layers
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Solution Overview
Problem
Current integrated passive device (IPD) technologies face challenges in reducing footprint and costs while simplifying fabrication processes, and achieving effective coupling and directionality in RF components for portable wireless devices.
Innovation Solution
A novel substrate with integrated passive devices is developed, where passive device patterns are formed directly in under bump metal (UBM) layers, intermediate dielectric layers, or redistribution layers, without the need for an additional Si interposer, allowing concurrent formation during patterning or via filling processes, thereby reducing steps and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If passive devices are formed in separate layers or with additional Si interposer, then device functionality is achieved, but product size and fabrication complexity increase
Solution Approach 1:
The patent merges the formation of passive devices with existing structural layers (UBM layers, dielectric layers, redistribution layers) by forming passive device patterns concurrently during the patterning or via filling processes of these layers. This integration eliminates the need for separate passive device fabrication steps and additional Si interposers, thereby reducing both product size and fabrication complexity while maintaining full device functionality
2Area of stationary object
If discrete passive devices are used, then device functionality is achieved, but circuit board area and assembly costs increase
Solution Approach 1:
The patent integrates passive devices directly into the substrate structure by forming passive device patterns within existing layers during standard fabrication processes. This eliminates the need for separate discrete passive components and their associated assembly operations, thereby reducing circuit board area and assembly costs while maintaining full functionality
Solution Approach 2:
The substrate structure serves multiple functions simultaneously: it provides mechanical support, electrical interconnection through redistribution layers, and passive device functionality all in one integrated platform. This multi-functionality eliminates the need for separate discrete components and reduces overall system complexity
Data Source
AI summary
A substrate with integrated passive devices and method of manufacturing the same are presented. The substrate may include through silicon vias, at least one redistribution layer having a 1st passive device pattern and stacked vias, and an under bump metal layer having a 2nd passive device pattern.