Integrated Passive Devices With Thin-Film Magnetic Inductors
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Solution Overview
Problem
Integrated passive devices (IPDs) and integrated circuits (ICs) face challenges in achieving optimal performance and cost-effectiveness due to the complexity and cost of including thin-film magnetic inductors on IC substrates, which increases manufacturing yield and cost, and there is a need for improved functionality and performance by locating these components close to each other.
Innovation Solution
The integration of a thin-film magnetic inductor within a multilevel wiring structure on a substrate, featuring a magnetic core and conductive windings, along with a vertical conductive interconnect, and the use of a magnetic polymer to enhance inductance and reduce electromagnetic interference, allowing for a low-profile design that can be integrated closely with ICs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thin-film magnetic inductors are included on the IC substrate, then the functionality and performance of the IC is improved, but the manufacturing complexity and cost substantially increase
Solution Approach 1:
The patent divides the system into two separate components: an IC chip and a separate IPD (integrated passive device) containing the thin-film magnetic inductor. This segmentation allows the IC to maintain simple CMOS fabrication processes while the inductor functionality is provided by a dedicated passive device, thereby improving functionality without increasing IC manufacturing complexity
Solution Approach 2:
The patent embeds the IPD within a package structure that also contains the IC chip, creating a nested arrangement where the passive device is housed within the same package as the active circuit. This integration provides close coupling and improved performance while keeping the manufacturing processes separate and simple
2Adaptability or versatility
If thin-film magnetic inductors are included on the IC substrate, then the circuit function is improved, but the manufacturing cost substantially increases
Solution Approach 1:
By separating the inductor functionality into a dedicated IPD, the patent enables each component to be manufactured using optimized, cost-effective processes. The IC can use standard CMOS fabrication while the IPD uses appropriate passive device manufacturing techniques, avoiding the costly and complex process of integrating thin-film magnetic inductors directly into the IC substrate
Solution Approach 2:
The patent creates a separate IPD that replicates the inductor functionality needed by the IC, rather than attempting to create the inductor within the IC substrate itself. This approach allows the use of proven, cost-effective passive device manufacturing processes to produce the required inductance characteristics
3Productivity
If the IPD and IC are located as close as possible to one another, then the performance is improved, but the device complexity increases
Solution Approach 1:
The patent places the IPD within the same package as the IC chip, creating a nested configuration where the passive device is housed in the package structure alongside the active circuit. This arrangement achieves close physical proximity for improved performance while maintaining separate, simple manufacturing processes for each component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables improved inductance and reduced electromagnetic interference, enhancing the performance of IPDs and ICs while reducing manufacturing complexity and cost by allowing for closer integration, thus improving the overall functionality and efficiency of the system.
Implementation Method 1
a magnetic core disposed within the second insulator layer. The first metal wire, the VIA, and the second metal wire comprise a conductive winding around the magnetic core
Implementation Method 2
The inductor includes a first wiring plane of the multilevel wiring structure, the first wiring plane including a first metal wire. The inductor also includes a second wiring plane of the multilevel wiring structure, the second wiring plane including a second metal wire. The inductor also includes a vertical conductive interconnect (VIA) extending from the first wire to the second wire, the VIA electrically connecting the first and second wires
Data Source
AI summary
An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed.