Implantable Pulse Generator Feedthru EMI Filtering

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current feedthru designs for implantable pulse generators, such as pacemakers and defibrillators, have high material and manufacturing costs due to the use of discoidal filter assemblies and feedthru wires made of expensive materials like platinum iridium, necessitating a cost-effective alternative.

Innovation Solution

The implementation of an implantable pulse generator feedthru with an electrically insulating body, a power circuit, and a ground circuit that utilizes off-the-shelf chip capacitors as EMI filters, eliminating the need for expensive feedthru wires and reducing material costs by integrating a compact, low-profile design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If discoidal filter assemblies and feedthru wires made of platinum iridium are used, then EMI filtering performance is improved, but material cost and manufacturing cost increase significantly

Engineering Contradiction:
ImproveEMI filtering performanceVSAvoidmaterial cost and manufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive platinum iridium feedthru wires with cost-effective alternative conductive materials such as gold-plated copper or silver-plated copper wires that maintain adequate electrical conductivity and EMI filtering performance while significantly reducing material costs. The feedthru assembly uses disposable-like replacement strategies where standardized connectors allow for cost-efficient manufacturing and potential replacement.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent modifies the material parameters of the feedthru wires by changing from precious metal compositions (platinum iridium) to base metal compositions with protective plating (gold-plated copper, silver-plated copper). This parameter change maintains the essential electrical conductivity and EMI shielding functions while dramatically reducing material costs and improving manufacturability.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If expensive feedthru wires and discoidal filter assemblies are used, then electrical connection reliability is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidfeedthru design complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the feedthru assembly into distinct functional components: connector blocks with contact elements, insulating feedthru wires, and filter assemblies. This segmentation allows each component to be manufactured independently using optimized processes and then assembled, reducing overall design complexity while maintaining electrical connection reliability through standardized interfaces.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent designs universal connector blocks and standardized feedthru wire interfaces that can accommodate multiple wire types and configurations. This multi-functionality reduces the need for custom-designed connections for each application, simplifying the overall feedthru design while ensuring reliable electrical connections across different implantable pulse generator models.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If traditional feedthru designs with discoidal filters are used, then EMI protection is improved, but the size and compactness of the feedthru are reduced

Engineering Contradiction:
ImproveEMI protectionVSAvoidfeedthru size and compactness
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent replaces bulky discoidal filter assemblies with thin-film EMI filtering structures integrated directly into the feedthru wire insulation layer. This thin-film approach provides effective EMI protection while maintaining a compact, space-efficient feedthru design that fits within the constrained geometry of implantable pulse generators.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent nests the EMI filter functionality within the existing feedthru wire structure by incorporating filtering layers within the insulation coating itself. This nested design eliminates the need for separate external filter assemblies, reducing overall feedthru volume while maintaining EMI protection capabilities.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly reduces material and manufacturing costs while maintaining effective EMI filtering, allowing for a more compact and efficient feedthru design that can be integrated into various parts of the implantable pulse generator.

Implementation Method 1

a chip capacitor coupled to the body and including a power side electrically coupled to the power circuit and a ground side electrically coupled to the ground circuit

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS8718775B2Implantable pulse generator EMI filtered feedthru
Publication Date: 2014.05.06 PACESETTER INC
  • US8718775B2 patent drawing
  • US8718775B2 patent drawing
  • US8718775B2 patent drawing

AI summary

An implantable pulse generator includes a header, a can and a feedthru. The feedthru is mounted in a wall of the can and includes an electrically insulating core, a PCB, a shield, a chip capacitor, a power circuit and a ground circuit. A first side of the PCB abuts against the core and a second side of the PCB abuts against an edge of the shield. The chip capacitor is mounted on the second side of the PCB. The chip capacitor is enclosed in a volume defined by an interior of the shield and the second side of the PCB. A first electrical contact of the chip capacitor is electrically coupled to the power circuit, and a second electrical contact of the chip capacitor is electrically coupled to the ground circuit.