Implantable Pulse Generator Header Pre-Assembly Testing
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Solution Overview
Problem
Current implantable pulse generator (IPG) header designs and manufacturing techniques face challenges in maintaining component alignment, spacing, and isolation, leading to difficulties in testing assemblies before completion, high scrap rates, and increased costs due to fragile connectors and complex assembly processes.
Innovation Solution
The method involves forming a subassembly with spring contact rings, ring seals, and a sleeve, allowing for interim testing before overmolding, which secures the components in position and ensures electrical isolation, using deformable ring seals and robust spring contact rings to resist molding pressures and maintain alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional header manufacturing techniques are used, then assembly is completed, but component alignment, spacing, and isolation are difficult to maintain
Solution Approach 1:
The patent applies preliminary action by pre-assembling the subassembly (including contacts, seals, and strain relief) before the overmolding process. This allows alignment and spacing to be established in advance, and testing to be performed before final encapsulation, thereby maintaining manufacturing precision while reducing process complexity.
Solution Approach 2:
The patent segments the header manufacturing process into distinct phases: subassembly formation, interim testing, and overmolding. By dividing the process into manageable segments, the patent maintains component alignment and spacing during assembly while simplifying the overall manufacturing complexity through staged completion.
2Reliability
If traditional manufacturing processes are used, then header is completed, but testing before completion is difficult
Solution Approach 1:
The patent performs testing as a preliminary action before the overmolding step. The subassembly is fully assembled and tested for electrical continuity and mechanical integrity before final encapsulation. This preliminary testing improves reliability by identifying defects early, while the modular subassembly approach keeps the manufacturing process simple and manageable.
3Ease of manufacture
If fragile connectors are used, then assembly is achieved, but scrap rate increases
Solution Approach 1:
The patent applies beforehand cushioning by incorporating strain relief components and robust spring contacts into the subassembly before overmolding. These elements provide mechanical cushioning and protection against damage during assembly and handling, thereby reducing scrap rate while maintaining assembly feasibility. The subassembly structure itself provides protective cushioning for fragile connectors.
4Manufacturing precision
If complex assembly processes are used, then header is completed, but costs increase
Solution Approach 1:
The patent segments the manufacturing process into a standardized subassembly formation step followed by overmolding. This segmentation allows for efficient production of interchangeable subassemblies that can be tested and validated once, then replicated. The standardization reduces manufacturing costs while maintaining precise component isolation and alignment through the modular design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of scrap and costs by enabling pre-overmolding testing, improving mechanical and electrical properties, and simplifying the manufacturing process, resulting in a more reliable and cost-effective IPG header.
Implementation Method 1
spring contact rings... to resist molding pressures and maintain alignment
Implementation Method 2
deformable ring seals... to resist molding pressures and maintain alignment
Data Source
AI summary
A header for use in implantable pulse generator devices. The header is part of electrical connector assembly having one or more openings designed to receive the terminal pin of an electrical lead wire or electrode. The header is designed to provide and sustain long-term electrical and mechanical lead wire connections between the electrodes of a terminal pin and the implantable pulse generator device.