IPL Transfer Conductive Patterns for Narrow Display Wiring
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Solution Overview
Problem
The miniaturization of conductive patterns in display devices, such as wiring or pads, leads to reliability degradation due to the challenges in forming precise and thick conductive features with narrow widths.
Innovation Solution
A method involving the sequential formation of a release layer and a conductive layer on a transfer substrate with a mask, followed by intense pulsed light (IPL) irradiation to transfer and sinter the conductive pattern on a substrate, achieving a conductive pattern with a width of 10 μm or less and a thickness of 10% or more of the width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the conductive pattern is miniaturized to reduce the non-display area, then the display area can be widened, but the reliability of the display device degrades
Solution Approach 1:
The patent transitions from planar conductive patterns to three-dimensional protruding conductive patterns. By forming conductive patterns that extend vertically from the substrate surface, the invention achieves miniaturization in the horizontal plane while maintaining electrical performance and reliability through the vertical dimension. The protruding structure provides larger effective contact area and improved mechanical strength despite reduced footprint.
Solution Approach 2:
The invention changes the geometric parameters of the conductive pattern by forming protrusions with controlled height, width, and thickness. By adjusting these parameters, the patent achieves miniaturization while maintaining reliability - the protruding structure provides both small horizontal dimensions for high-density routing and sufficient vertical dimension for electrical performance.
2Area of stationary object
If the conductive pattern width is reduced to 10 μm or less, then the non-display area is reduced, but the manufacturing precision required increases
Solution Approach 1:
By forming protruding conductive patterns with vertical height, the invention compensates for the reduced horizontal width. The three-dimensional structure allows the pattern to maintain adequate cross-sectional area for electrical performance while achieving the required small footprint, reducing the stringency of manufacturing precision requirements.
Solution Approach 2:
The patent employs a composite structure consisting of the conductive pattern material and the underlying substrate, forming an integrated protruding structure. This composite approach allows the conductive pattern to achieve both small horizontal dimensions and sufficient electrical performance through the combined geometry of the protrusion and substrate interaction.
3Reliability
If the conductive pattern thickness is increased to maintain reliability, then the manufacturing complexity increases, but the miniaturization benefit is reduced
Solution Approach 1:
The invention utilizes the vertical dimension to provide the necessary conductive cross-sectional area without increasing horizontal dimensions or manufacturing complexity. By forming protrusions that extend vertically from the substrate, the patent achieves both miniaturization in the plane and sufficient thickness for reliability in a single integrated structure.
Solution Approach 2:
The patent merges the conductive pattern formation with the substrate structure to create an integrated protruding conductive pattern. This combination eliminates the need for separate thick-film deposition or multi-layer structures, achieving both miniaturization and sufficient thickness while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of minute conductive patterns with high reliability and strength, effectively reducing the non-display area in display devices while maintaining the integrity of the conductive features.
Implementation Method 1
irradiating intense pulsed light (IPL) to a substrate; placing the transfer substrate on the substrate; transferring a portion of the conductive layer, corresponding to an opening of the mask, onto the substrate by irradiating the IPL to the transfer substrate
Implementation Method 2
sintering the conductive pattern by irradiating IPL to the substrate where the conductive pattern is formed
Data Source
AI summary
A conductive pattern forming method according to an embodiment includes: forming a first conductive pattern on a substrate; sequentially forming a release layer and a conductive layer on a transfer substrate that includes a mask; irradiating intense pulsed light (IPL) to the substrate where the first conductive pattern is formed; placing the transfer substrate on the substrate; transferring a portion of the conductive layer, corresponding to an opening of the mask, onto the substrate by irradiating the IPL to the transfer substrate to form a second conductive pattern on the substrate.