Intelligent Power Module Compact Layout and Lead Reduction
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Solution Overview
Problem
Conventional molded intelligent power modules (IPMs) for motor driving have large top surface areas and a high number of leads, which increase manufacturing costs and reduce compactness.
Innovation Solution
The design optimizes the layout by using two driving ICs instead of three, attaching them to a tie bar, and incorporating conformal curved sides and through holes to reduce leads and moisture formation, with a molding encapsulation that encloses MOSFETs, ICs, and boost diodes, and uses a reduced number of leads by wire-bonding diodes to a power supply pin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If three driving ICs are used in conventional IPM, then motor driving functionality is achieved, but device complexity and top surface area increase
Solution Approach 1:
The patent combines multiple driving functions into two integrated circuits instead of using three separate ICs. The first and second driving ICs are mounted on the same side of the substrate and collectively provide the motor driving functionality that would otherwise require three ICs, thereby reducing device complexity while maintaining full adaptability for motor control applications
2Reliability
If conventional layout is used, then all necessary components are accommodated, but top surface area is large
Solution Approach 1:
The patent utilizes conformal curved sides that follow the contour of the substrate, allowing components to be arranged in a optimized two-dimensional layout that minimizes the top surface area. The curved sides enable better space utilization by adapting to the substrate geometry rather than using straight-line arrangements, thereby reducing the overall footprint while accommodating all necessary components
3Reliability
If many leads are used, then all electrical connections are established, but manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates unnecessary leads from the conventional design. By carefully analyzing the electrical connection requirements and using the reduced number of driving ICs, the design removes redundant leads while maintaining all essential electrical connections between components and external terminals, thereby reducing manufacturing complexity and cost
4Reliability
If through holes are added to reduce moisture formation, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates through holes in the substrate that create a porous structure allowing for moisture ventilation. These holes enable moisture to escape from enclosed spaces within the IPM package, preventing condensation and improving reliability in humid environments. The porous design is integrated into the substrate structure in a way that minimizes additional manufacturing complexity
Data Source
AI summary
An intelligent power module (IPM) has a first, second, third and fourth die paddles, a first, second, third, fourth, fifth and sixth transistors, a tie bar, a low voltage IC, a high voltage IC, a first, second and third boost diodes, a plurality of leads and a molding encapsulation. The first transistor is attached to the first die paddle. The second transistor is attached to the second die paddle. The third transistor is attached to the third die paddle. The fourth, fifth and sixth transistor s are attached to the fourth die paddle. The low and high voltage ICs are attached to the tie bar. The molding encapsulation encloses the first, second, third and fourth die paddles, the first, second, third, fourth, fifth and sixth transistors, the tie bar, the low and high voltage ICs, and the first, second and third boost diodes. The IPM has a reduced top surface area and a reduced number of leads compared to a conventional IPM.