Intelligent Power Module Heat Dissipation via Integrated Frame

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Solution Overview

Problem

Existing power modules for vehicles face challenges in efficiently dissipating heat, which can lead to overheating and reduced reliability, especially in electric and hybrid vehicles where high performance and safety are critical.

Innovation Solution

The development of an intelligent power module with a heat radiation device, an attachment frame, and a drive circuit part mounted via a heat insulating sheet, which includes multiple power semiconductor modules configured as two-in-one or six-in-one modules, enhancing heat dissipation and modularization, and suitable for miniaturization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a radiator such as a heat sink plane or fin is disposed on the back side of the semiconductor device to dissipate heat, then heat dissipation capability is improved, but the module size increases and miniaturization becomes difficult

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidmodule size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent combines the heat radiation device and attachment frame into an integrated structure where the attachment frame is formed as part of the heat radiation device body. This merging eliminates the need for separate heat sink components while maintaining effective heat dissipation through the integrated heat radiation surfaces and cooling channels.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent implements a nested structure where the attachment frame is positioned within the heat radiation device, and power semiconductor modules are mounted on the attachment frame. This nesting arrangement allows multiple functional components to occupy overlapping spatial volumes, reducing the overall module footprint while maintaining all necessary functions.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If multiple separate power semiconductor modules are used to achieve high functionality, then versatility is improved, but device complexity increases and modularization becomes difficult

Engineering Contradiction:

ImprovefunctionalityVSAvoidmodularization difficulty

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The attachment frame is designed as a universal mounting structure that can accommodate different types and configurations of power semiconductor modules. The standardized frame interface allows various module combinations (such as IGBT modules, MOSFET modules, or diode modules) to be mounted on the same heat radiation device, enabling flexible system configuration without increasing overall complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent segments the power semiconductor modules as independent, replaceable units mounted on the integrated heat radiation device. This segmentation allows individual modules to be selected, replaced, or upgraded independently while maintaining a standardized mounting platform, thus achieving high versatility without proportionally increasing system complexity.

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If the drive circuit part is mounted directly on the power semiconductor module without heat insulation, then ease of manufacture is improved, but the reliability decreases due to heat affecting the drive circuit

Engineering Contradiction:

Improveassembly simplicityVSAvoiddrive circuit reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces a heat insulating sheet as an intermediary layer between the power semiconductor module and the drive circuit part. This thin insulating barrier effectively blocks heat transfer to the drive circuit while maintaining electrical connectivity and mechanical attachment, thus protecting the drive circuit from thermal damage without significantly complicating the assembly process.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides excellent heat radiation characteristics, improves the reliability and safety of electric and hybrid vehicles by efficiently cooling power semiconductor modules, preventing overheating, and enabling high-performance operation.

Implementation Method 1

a drive circuit part mounted on the power semiconductor module via a heat insulating sheet

Methodology Applied

Scientific EffectThermal Insulation: Thermal Insulation

Implementation Method 2

a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device

Methodology Applied

Scientific EffectHeat radiation: Thermal Radiation

Data Source

PatentUS20240253613A1Intelligent power module, electric vehicle or hybrid vehicle, and method of assembling intelligent power module

Publication Date: 2024.08.01 ROHM CO LTD

AI summary

An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.