Intelligent Power Module Integrated Radiator Heat Dissipation
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Solution Overview
Problem
Intelligent power modules face challenges with high thermal resistance due to insulating layers, leading to increased manufacturing costs and complexity, and the need for additional radiators which complicates assembly and application, especially in civilian settings.
Innovation Solution
The intelligent power module incorporates a paper radiator with heat dissipating corrugations on its lower surface and an insulating layer on the upper surface, along with a sealing resin to enhance heat dissipation and reduce manufacturing complexity, eliminating the need for external radiators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a high thermal-conductive insulating layer is used to improve heat dissipation, then heat dissipation performance is improved, but manufacturing cost increases and manufacturing difficulty increases due to high hardness from heavy doping
Solution Approach 1:
The patent merges the insulating layer and radiator into a single integrated component. The insulating layer is formed on the radiator with a thermal conductivity of 0.5-2.0 W/m·K, which is lower than traditional high thermal-conductive insulating layers but sufficient when combined with the radiator's heat dissipation structure. This integration eliminates the need for separate insulating layers and radiators, reducing manufacturing steps and difficulty while maintaining effective heat dissipation.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the insulating layer from the traditional high value (requiring heavy doping) to a moderate range of 0.5-2.0 W/m·K. This parameter change reduces the doping requirement, thereby reducing manufacturing difficulty and cost while still achieving effective heat dissipation when combined with the radiator structure.
2Temperature
If a radiator is added to the interior of the intelligent power module, then heat dissipation is improved, but raw material cost increases and processing difficulty increases
Solution Approach 1:
The radiator is integrated with the circuit board to form a unified structure. The radiator is formed as an extension or embedded feature of the circuit board itself, eliminating the need for separate radiator components and reducing processing steps. This integration reduces both raw material cost and processing difficulty while maintaining effective heat dissipation.
3Temperature
If a radiator is added to the exterior of the intelligent power module, then heat dissipation is improved, but application cost increases and assembly difficulty increases
Solution Approach 1:
The radiator is merged with the circuit board structure, forming an integrated assembly that requires no separate assembly steps. The radiator becomes an inherent part of the module structure, eliminating the need for external attachment and reducing assembly difficulty. This integration also reduces application cost by eliminating additional components and assembly operations.
4Temperature
If the circuit base board is used to dissipate heat, then heat dissipation is provided, but overall thermal resistance is high due to the insulating layer
Solution Approach 1:
The circuit board and radiator are merged into a single integrated structure with direct thermal coupling. The radiator is formed as part of the circuit board assembly, eliminating thermal interface resistance between separate components. This integration reduces overall thermal resistance while maintaining the electrical insulation function, improving heat dissipation effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation, reduces manufacturing costs, and simplifies assembly, while maintaining the reliability and stability of the power module, making it suitable for civilian applications.
Implementation Method 1
a heat dissipating corrugation is provided to a lower surface of the radiator... by providing the heat dissipating corrugation to the lower surface of the radiator, most heat of the circuit component is allowed to emit out rapidly
Implementation Method 2
a heat dissipating corrugation is provided to a lower surface of the radiator... making the intelligent power module constantly operate in a low temperature environment
Implementation Method 3
an insulating layer is provided to an upper surface of the radiator... due to existence of an insulating layer, an overall thermal resistance of the intelligent power module is high
Data Source
AI summary
An intelligent power module and a manufacturing method thereof are provided. The intelligent power module includes a radiator, an insulating layer, a circuit wiring, a circuit component and a metal wire. At least part of a lower surface of the radiator is defined as a heat dissipating area, the heat dissipating area is provided with a heat dissipating corrugation, the insulating layer is provided to an upper surface of the radiator, the circuit wiring is provided to the insulating layer, and the circuit component is provided to the circuit wiring and is connected to the circuit wiring via the metal wire.