Intelligent Power Module Metal Slug Thermal Dissipation
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Solution Overview
Problem
Conventional molded intelligent power modules (IPMs) for motor driving face challenges in reducing operational temperature, which affects their performance and power rating.
Innovation Solution
Incorporating a metal slug within the IPM to enhance heat dissipation, achieved by creating a vertical gap between the die paddles and the metal slug using spacers, which reduces thermal resistance and increases die size, thereby increasing power rating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional IPM structure is used without metal slug, then device complexity is low, but thermal resistance is high and heat dissipation is poor
Solution Approach 1:
The metal slug is nested within the molding encapsulation, creating a hierarchical structure where the slug is embedded in the encapsulation material. This nesting approach allows the heat dissipation component to be integrated within the existing IPM structure without significantly increasing external dimensions or overall complexity.
Solution Approach 2:
The metal slug acts as a thermal intermediary between the die paddles and the external environment. It receives heat from the die paddles through thermal conduction and dissipates it to the surroundings, mediating the heat transfer process and reducing operational temperature.
2Power
If die size is increased from 6.2 mm×6.2 mm to 10.0 mm×10.0 mm, then power rating increases, but thermal management becomes more challenging
Solution Approach 1:
The invention changes the thermal parameters of the IPM by introducing a metal slug with high thermal conductivity. This parameter change enables the system to handle higher power ratings by improving the thermal conduction pathway, allowing larger die sizes to be effectively managed.
Solution Approach 2:
The IPM employs a composite structure combining different materials: the metal slug (high thermal conductivity) embedded in the molding encapsulation (structural support and insulation). This composite approach optimizes both thermal management and mechanical properties to support increased power ratings.
3Loss of energy
If thermal resistance is reduced by 40%, then heat dissipation improves, but manufacturing complexity increases
Solution Approach 1:
The metal slug is prepared and positioned in advance during the manufacturing process, before the molding encapsulation is applied. This preliminary action simplifies the overall manufacturing by pre-assembling the thermal management component, reducing the complexity of the final assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of a metal slug reduces thermal resistance by 40% and increases the die size from 6.2 mm×6.2 mm to 10.0 mm×10.0 mm, leading to enhanced heat dissipation and increased power rating.
Implementation Method 1
A bottom surface of the metal slug is exposed from the molding encapsulation to facilitate heat dissipation
Data Source
AI summary
An intelligent power module (IPM) has a first, second, third and fourth die paddles, a first, second, third, fourth, fifth and sixth metal-oxide-semiconductor field-effect transistors (MOSFETs), a tie bar, a metal slug, a plurality of spacers, a plurality of leads and a molding encapsulation. The molding encapsulation encloses the first, second, third and fourth die paddles, the first, second, third, fourth, fifth and sixth MOSFETs, the tie bar and the plurality of spacers. A bottom surface of the metal slug is exposed from the molding encapsulation. A process for fabricating the IPM comprises preparing the first, second, third and fourth die paddles, the first, second, third, fourth, fifth and sixth MOSFETs, the tie bar, the plurality of leads, the metal slug and the plurality of spacers and applying a molding process to form the molding encapsulation.