IPM Package Layout Using Lead-Frame Dies to Cut DBC Cost
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Solution Overview
Problem
Conventional Intelligent Power Module (IPM) packages face high costs due to the use of expensive Direct Bond Copper (DBC) substrates for heat dissipation, and lead frame designs lead to uneven lead distribution and mold compound overflow, necessitating improved package and manufacturing methods.
Innovation Solution
The solution involves attaching cooperation device dies to a lead frame instead of a mounting substrate, reducing the size of the DBC substrate and optimizing lead frame layout for even distribution, thereby improving heat dissipation and reducing costs while preventing mold compound overflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If expensive DBC substrates are used for mounting power-side devices, then heat dissipation performance is improved, but packaging costs increase significantly
Solution Approach 1:
The patent replaces expensive DBC substrates with a more economical lead frame structure that can adequately dissipate heat for the specific application requirements. The lead frame serves as a cost-effective alternative that meets the thermal management needs without incurring significant material costs.
Solution Approach 2:
The invention extracts the cooperation device die from the mounting substrate and relocates it to the lead frame. This separation allows the mounting substrate to be minimized or replaced, reducing overall packaging costs while maintaining heat dissipation performance through optimized lead frame design.
2Reliability
If lead sizes are increased to ensure soldering strength, then soldering reliability is improved, but lead distribution becomes uneven and mold compound overflow risk increases
Solution Approach 1:
The patent applies different lead size specifications to different functional requirements. Leads connected to power dies have larger cross-sections for soldering strength, while leads for cooperation device dies have optimized sizes appropriate for their lower power requirements. This localized differentiation achieves both reliability and uniform distribution.
Solution Approach 2:
The invention employs asymmetric lead design where lead dimensions vary according to their specific functional needs rather than using uniform sizes. This asymmetric approach allows each lead to be optimized for its particular connection requirements while maintaining overall layout balance and preventing mold compound overflow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces packaging costs by up to 45.9% while maintaining heat dissipation performance and enhancing product reliability through even lead distribution and simplified layout design.
Implementation Method 1
during a normal operation an amount of heat generated by the cooperation device is less than an amount of heat generated by the power device
Data Source
AI summary
The present disclosure relates to package, manufacturing method, and electrical system. The package comprises: a mounting substrate with at least one power die having a power device and attached to a first surface of the mounting substrate; and a lead frame comprising a first die attachment portion and at least one first lead, wherein at least one cooperation device die having a cooperation device for cooperating with the power device is attached to the first die attachment portion, and wherein during a normal operation an amount of heat generated by the cooperation device is less than an amount of heat generated by the power device, wherein the at least one first lead is coupled to the first surface of the mounting substrate to be electrically coupled to the power die.