Intelligent Power Module Thermal Management via Segmented Cooling
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Solution Overview
Problem
Existing power semiconductor modules in electric vehicles and hybrid cars face challenges in heat dissipation, leading to potential overheating and degradation, which complicates their miniaturization and modularization.
Innovation Solution
The intelligent power module incorporates a heat sink with multiple power semiconductor modules and a driving circuit part, utilizing a bonding material with high heat conductivity and a heat dissipation plate to effectively dissipate heat, allowing for improved cooling and modular design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power semiconductor modules are densely packed to achieve miniaturization, then the volume of the module is reduced, but heat dissipation becomes more difficult leading to overheating
Solution Approach 1:
The patent divides the module into distinct functional segments: a first power semiconductor module and a second power semiconductor module, each with dedicated cooling structures. The cooling device is segmented into a first cooling structure coupled to the first module and a second cooling structure coupled to the second module, allowing independent heat management for each segment while maintaining compact overall dimensions.
Solution Approach 2:
The patent transitions from planar heat dissipation to three-dimensional heat management by positioning cooling structures in vertical and lateral dimensions. The first and second cooling structures are arranged to cool respective modules from different spatial perspectives, utilizing vertical stacking and lateral positioning to maximize heat dissipation surface area within limited module volume.
2Adaptability or versatility
If multiple power semiconductor modules are integrated into a single module to achieve modularization, then the number of separate components is reduced, but the complexity of heat management increases
Solution Approach 1:
The patent applies segmentation by providing dedicated cooling structures for each power semiconductor module within the integrated assembly. The first cooling structure is specifically coupled to the first power semiconductor module, and the second cooling structure is specifically coupled to the second power semiconductor module, allowing independent thermal management for each module while maintaining modular integration.
Solution Approach 2:
The cooling device serves multiple functions simultaneously: it cools the first power semiconductor module through the first cooling structure, cools the second power semiconductor module through the second cooling structure, and maintains compact module dimensions. This multi-functional cooling system simplifies heat management complexity while achieving effective thermal control across the integrated module.
3Device complexity
If conventional cooling structures are used, then the structure is simple, but heat dissipation efficiency is insufficient leading to potential overheating
Solution Approach 1:
The patent implements local quality by providing specialized cooling structures positioned adjacent to each power semiconductor module. The first cooling structure is locally coupled to the first module, and the second cooling structure is locally coupled to the second module, ensuring that heat dissipation is optimized at each specific location rather than using a uniform conventional cooling approach.
Solution Approach 2:
The cooling device acts as an intermediary between the power semiconductor modules and the heat sink. The first cooling structure mediates heat transfer from the first module, and the second cooling structure mediates heat transfer from the second module, improving heat dissipation efficiency while maintaining structural simplicity through the use of intermediate cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation properties, prevents overheating, and enables the miniaturization and modularization of power semiconductor modules, thereby improving the reliability and efficiency of electric vehicles and hybrid cars.
Implementation Method 1
utilizing a bonding material with high heat conductivity and a heat dissipation plate to effectively dissipate heat
Implementation Method 2
a cooling part on which the sealing body is mounted, and configured to cool the power semiconductor module
Data Source
AI summary
An intelligent power module includes at least one power semiconductor module including a semiconductor device, and a sealing body sealing an outer periphery of the semiconductor device, a driving circuit part mounted on the sealing body and configured to drive the power semiconductor module, and a cooling part on which the sealing body is mounted, and configured to cool the power semiconductor module.